Growth prediction of tin/copper intermetallics formed between 63/37 Sn/Pb and OSP coated copper solder pads for a flip chip application

Prediction of damage and fatigue life of high-temperature flip chip assembly interconnections at operations

“…The viscoplastic damage, measured by indicators such as strain energy density and plastic work, accumulates cycle by cycle and eventually culminates in solder joint failure through fatigue cracking mechanism. Metallurgical reactions involving solder alloys, copper in the bond pad and pad metalisation during both reflow assembly process and life operations produce and grow IMC respectively at the interfaces of solder bulk and the bond pads [12,[16][17][18][19][20][21]. The lead-free solder used in FC manufacture contains Sn3.9Ag0.6Cu alloy materials [22].…”