High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height

Amalu, Emeka H.; Ekere, N.N.

doi:10.1016/j.microrel.2012.07.024

Cited by 15 publications

(5 citation statements)

References 28 publications

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“…The maximum equivalent stress appears on the contact surface between the upper substrate and UBM at the second solder joint on the edge, the minimum appears on the middle of the lower substrate. The overall distribution law conforms to the analysis of the equivalent stress spreading to the edge, and the equivalent stress and strain of the solder joints at the edge is greater than that of the solder joints near the center [13]. The accumulation of equivalent viscoplastic strain increases outwardly from the center of the solder joint, the high-level distribution mainly appears at the corner contact position between the UBM and the solder joint.…”

Section: Ecie-2022 Journal Of Physics: Conference Series 2221 (2022) ...supporting

confidence: 70%

Research on the reliability of Micro LED high-density solder joints under thermal cycling conditions

Nie

Liu

et al. 2022

J. Phys.: Conf. Ser.

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For the purpose of studying the effect of high-density, small-size solder joints on the thermal fatigue life of display devices, a 3D model of the corresponding device structure is established, using finite element analysis methods, and using Anand constitutive equations and Coffin-Manson life prediction models. The equivalent stress and strain change law of an indium solder joint with a diameter of 10 μm under thermal cycling loading conditions is explored, and the key position of the solder joint damage is inferred based on the simulated strain cloud diagram. In addition, the influence of different bump height, bump contact area and Under-Bump Metallization (UBM) thickness on the thermal fatigue life of solder joints is studied separately. The final simulation results show that the location where the solder joint may be damaged first is at the point on the outer side where the solder joint is connected to the UBM on the edge away from the center point. The height of the bump and the contact area of the bump have a significant effect on its thermal fatigue life. In the actual experiment, we should focus on the impact of this aspect.

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Section: Ecie-2022 Journal Of Physics: Conference Series 2221 (2022) ...supporting

confidence: 70%

Research on the reliability of Micro LED high-density solder joints under thermal cycling conditions

Nie

Liu

et al. 2022

J. Phys.: Conf. Ser.

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“…Intermetallic compounds (IMCs) with a thickness of 6 µm, comprising Cu 3 Sn 5 and Ag 3 Sn on either side of the solder material, were used to completely model the interconnection. For the characterization of solder alloys, the Garofalo-Arrhenius model [34], using accumulated creep strain and dissipated strain energy density, which has an exponential dependence on temperature and a hyperbolic sine dependence on high stress, is commonly accepted. The flow equation for creep strain rate is given by: .…”

Section: Solar Cell Materials and Propertiesmentioning

confidence: 99%

Study on Creep Damage in Sn60Pb40 and Sn3.8Ag0.7Cu (Lead-Free) Solders in c-Si Solar PV Cell Interconnections under In-Situ Thermal Cycling in Ghana

2021

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A numerical study on the creep damage in soldered interconnects in c-Si solar photovoltaic cells has been conducted using equivalent creep strain, accumulated creep strain and accumulated creep energy density methods. The study used data from outdoor weathering of photovoltaic (PV) modules over a three-year period (2012–2014) to produce temperature cycle profiles that served as thermal loads and boundary conditions for the investigation of the soldered interconnects’ thermo-mechanical response when exposed to real-world conditions. A test region average (TRA) temperature cycle determined in a previous study for the 2012–2014 data was also used. The appropriate constitutive models of constituent materials forming a typical solar cell were utilized to generate accurate material responses to evaluate the damage from the thermal cycles. This study modeled two forms of soldered interconnections: Sn60Pb40 (SnPb) and Sn3.8Ag0.7Cu (Pb-free). The results of the damage analysis of the interconnections generated from the thermal cycle loads using accumulated creep strain method showed that the Pb-free solder interconnection recorded greater damage than that of the SnPb-solder interconnection for the TRA, 2012, 2013 and 2014 temperature cycles. The percentage changes from SnPb to Pb-free were 57.96%, 43.61%, 44.87% and 45.43%, respectively. This shows significant damage to the Pb-free solder under the TRA conditions. Results from the accumulated creep energy density (ACED) method showed a percentage change of 71.4% (from 1.3573 × 105 J/mm3 to 2.3275 × 105 J/mm3) in accumulated creep energy density by replacing SnPb-solder with Pb-free solder interconnection during the TRA thermal cycle. At the KNUST test site in Kumasi, Ghana, the findings show that Sn60Pb40 solder interconnections are likely to be more reliable than Pb-free solder interconnections. The systematic technique employed in this study would be useful to the thermo-mechanical reliability research community. The study also provides useful information to PV design and manufacturing engineers for the design of robust PV modules.

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“…In the sub-modeling technique, a global coarse-mesh model is established and numerically analyzed first as shown in Fig.2 [7] . ANSYS can perform fatigue calculations for either constant amplitude loading or proportional non-constant amplitude loading [8] . Loading has four types: fully reversed, zero-based, ratio and history data.…”

Section: Basquin Equation As Followingmentioning

confidence: 99%

The fatigue life analysis of conductive adhesive

Liu

Huang

2013

2013 14th International Conference on Electronic Packaging Technology

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Considering the influence of the cost, reliability and environment issues, the lead-free material of solder connection is paid more and more attention in integrated circuit packaging field. As the substitute of traditional solder, conductive adhesive has its own advantages. In this paper, a ball grid array (BGA) is chosen to illustrate the fatigue model for the methods of strain-based and energy-based life prediction. The strain analysis theory and the finite element analysis (FEM) simulation of fatigue life prediction are introduced in this paper. The conductive adhesive's failure mechanism of theoretical analysis is described. By means of finite element analysis, thermal stress simulation curve of conductive adhesive is analysed. The curve (s-n curve) of conductive adhesive fatigue life and load amplitude as well as fatigue sensitivity coefficient is given. And failure of life under different stress is predicted. Finally, the outlook of conductive adhesive connection reliability is also expounded.

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High-temperature fatigue life of flip chip lead-free solder joints at varying component stand-off height

Cited by 15 publications

References 28 publications

Research on the reliability of Micro LED high-density solder joints under thermal cycling conditions

Research on the reliability of Micro LED high-density solder joints under thermal cycling conditions

Study on Creep Damage in Sn60Pb40 and Sn3.8Ag0.7Cu (Lead-Free) Solders in c-Si Solar PV Cell Interconnections under In-Situ Thermal Cycling in Ghana

The fatigue life analysis of conductive adhesive

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