Abstract:A numerical study on the creep damage in soldered interconnects in c-Si solar photovoltaic cells has been conducted using equivalent creep strain, accumulated creep strain and accumulated creep energy density methods. The study used data from outdoor weathering of photovoltaic (PV) modules over a three-year period (2012–2014) to produce temperature cycle profiles that served as thermal loads and boundary conditions for the investigation of the soldered interconnects’ thermo-mechanical response when exposed to … Show more
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