Growth behaviors of intermetallic compounds at Sn–3Ag–0.5Cu/Cu interface during isothermal and non-isothermal aging

Shen, Jun; Zhao, Mali; He, Peipei; Pu, Yayun

doi:10.1016/j.jallcom.2013.05.156

Cited by 64 publications

(24 citation statements)

References 23 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The morphology of the scallop η -Cu 6 Sn 5 IMC becomes planar as the channels between scallops provide convenient paths for the diffusion of Cu atoms. Thus, the IMC grows faster at the channels between scallops rather than on the top surface of the scallops during the initial aging stage [26, 50]. In other words, the Cu 6 Sn 5 IMC layer becomes planar rather than thickening in such conditions.…”

Section: Fundamental Studies Of Imcs Formation and Growth In Sac/cu Smentioning

confidence: 99%

“…In other words, the Cu 6 Sn 5 IMC layer becomes planar rather than thickening in such conditions. On the contrary, the Cu 3 Sn IMC layer remains planar but thickens significantly with increasing aging temperature and time [50, 51]. However, there might be a change in the Cu 3 Sn lattice structure, as Mookam and Kanlayasiri [47] reported that hexagonal Cu 3 Sn was also present in the joint interface after aging for 1000 h at 100 °C.…”

Section: Fundamental Studies Of Imcs Formation and Growth In Sac/cu Smentioning

confidence: 99%

“…As the growth of IMCs during thermal aging is governed by the solid-state diffusion mechanism, or more precisely the lattice diffusion dominated diffusion mechanism [50], the relationship between the IMC layer thickness and aging time can be expressed by the following equation [26, 27]. where the t is aging time, x 0 is the IMC thickness of the as-soldered joint, x t is the IMC thickness at aging time t , and D eff is the effective diffusion coefficient of the IMC during thermal aging.…”

Section: Fundamental Studies Of Imcs Formation and Growth In Sac/cu Smentioning

confidence: 99%

See 2 more Smart Citations

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Tan

Yusof

2015

Science and Technology of Advanced Materials

View full text Add to dashboard Cite

Nanocomposite lead-free solders are gaining prominence as replacements for conventional lead-free solders such as Sn–Ag–Cu solder in the electronic packaging industry. They are fabricated by adding nanoparticles such as metallic and ceramic particles into conventional lead-free solder. It is reported that the addition of such nanoparticles could strengthen the solder matrix, refine the intermetallic compounds (IMCs) formed and suppress the growth of IMCs when the joint is subjected to different thermal conditions such as thermal aging and thermal cycling. In this paper, we first review the fundamental studies on the formation and growth of IMCs in lead-free solder joints. Subsequently, we discuss the effect of the addition of nanoparticles on IMC formation and their growth under several thermal conditions. Finally, an outlook on the future growth of research in the fabrication of nanocomposite solder is provided.

show abstract

Section: Fundamental Studies Of Imcs Formation and Growth In Sac/cu Smentioning

confidence: 99%

Section: Fundamental Studies Of Imcs Formation and Growth In Sac/cu Smentioning

confidence: 99%

Section: Fundamental Studies Of Imcs Formation and Growth In Sac/cu Smentioning

confidence: 99%

See 1 more Smart Citation

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Tan

Yusof

2015

Science and Technology of Advanced Materials

View full text Add to dashboard Cite

show abstract

“…Aging of the samples at room temperature caused an increase in the IMC thickness of all the solder pastes. The soldering profile influence for the SAC paste can be compared with the results of Shen et al (2013). Shen observed the creation and growth of IMCs at the Sn-3Ag-0.5Cu/Cu interface during isothermal aging.…”

Section: Discussionmentioning

confidence: 99%

Correlation analysis of wettability, intermetallic compound formation and PCB contamination

2015

View full text Add to dashboard Cite

Purpose -The purpose of this paper is to verify how solder joint properties correlate with soldering profile set-up. These characteristics act against each other. All observed properties may significantly affect the quality and reliability of solder joints. The purpose is also to design recommendations for manufacturers of electronic assemblies. Design/methodology/approach -The samples for experiment were reflowed by using a laboratory reflow oven. A LEXT laser confocal microscope was used for wetting angle and intermetallic compound (IMC) thickness measurement. The ionic contamination was measured by using a contaminometer. Findings -The appropriate choice of soldering profile is very important for the reliability of electronic assemblies. The higher temperatures or longer preheating and soldering times improve the wetting angle. Likewise, there is also the activation of all the fluxes. The result is low contamination with printed circuit boards (PCBs). On the other hand, we must not forget that higher temperatures and longer soldering time also affect the thickness of the IMC. The outer limits recommended by the manufacturer were selected for the soldering profile set-up. Even within these limits, it is possible to achieve an improvement in the wetting angle, an improvement in levels of PCB contamination and an increase in the thickness of the IMC. This paper presents the results achieved for solders Sn42Bi57.6Ag0.4, Sn96.5Ag3Cu0.5 and Sn97Ag3. Originality/value -The gained knowledge on the correlation between IMC thickness, solderability of PCB and PCB contamination caused by different soldering profile set-ups can help to prevent reliability problems because each of the named effects has a significant influence on reliability.

show abstract

“…These gaps between scallops formed during reflowing would be the fast diffusion path and go on working at the initial stage of solid state aging. Since the gaps were not blocked at the initial stage of solid state aging, the Cu atoms would preferentially diffuse into the solder matrix from the gaps between scallops to form IMCs and flatten the IMC layers [11].…”

Section: Microstructural Morphologymentioning

confidence: 99%

In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging

Wang

et al. 2015

Journal of Alloys and Compounds

View full text Add to dashboard Cite

Growth behaviors of intermetallic compounds at Sn–3Ag–0.5Cu/Cu interface during isothermal and non-isothermal aging

Cited by 64 publications

References 23 publications

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Influence of nanoparticle addition on the formation and growth of intermetallic compounds (IMCs) in Cu/Sn–Ag–Cu/Cu solder joint during different thermal conditions

Correlation analysis of wettability, intermetallic compound formation and PCB contamination

In situ quantitative study of microstructural evolution at the interface of Sn3.0Ag0.5Cu/Cu solder joint during solid state aging

Contact Info

Product

Resources

About