Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock

Tian, Ruyu; Hang, Chunjin; Tian, Yanhong; Zhao, Liyou

doi:10.1016/j.msea.2017.10.007

Cited by 91 publications

(33 citation statements)

References 32 publications

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“…Although the alloy solder can join different materials with ultrahigh bonding strength, they usually need high heating temperatures. [30][31][32][33][34][35][36] On the contrary, the transient liquid phase (TLP) technology which utilizes the principle of eutectic bonding can be operated at low temperatures. Metal layers that can satisfy the eutectic conditions are usually used for the realization of eutectic bonding.…”

Section: Eutectic Hermetic Bonding For Mems Packaging In Wafer Sizementioning

confidence: 99%

Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics

Tian

et al. 2020

International Journal of Optomechatronics

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Section: Eutectic Hermetic Bonding For Mems Packaging In Wafer Sizementioning

confidence: 99%

Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics

Tian

et al. 2020

International Journal of Optomechatronics

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“…Further, the results of microstructural examination using SEM on extruded CSES and CSI solder joints revealed no cracks or debonding at the interface which means the interfacial integrity was good (see Figures 13 and 15 bonding between the substrate and solder mostly depends on the integrity of the intermetallic compound (IMC) layer. e long-term reliability of solder joints depends on how, at the interface, IMCs are formed as reaction products between the solder and the substrate during soldering [38][39][40][41][42]. In this study, IMCs were clearly observed in Cu/ SAC305/Cu solder joints (see Figures 13(a) Figures 13(a), 13(c), 13(e), 13(g), 13(i), 13(k), 13(m), and 13(o)) had slightly less thickness than CSI (before and after corrosion) solder joints (see Figures 13(b), 13(d), 13(f ), 13(h), 13(j), 13(l), 13(n), and 13(p), which reduced the brittleness in CSES joints thus making CSES solder joints marginally better in strength than CSI solder joints.…”

Section: Microstructural Characterization Figures 12 and 13mentioning

confidence: 99%

Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead‐Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

Sonawane

Raja

Gupta

2020

Advances in Materials Science and Engineering

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In this study, “Concentrated Solar Energy (CSE)” is applied for soldering and is named as the “Concentrated Solar Energy Soldering (CSES) technique.” Lead-free solders are used for comparing novel CSES technique solder joints with CSI (Conventional Soldering Iron) solder joints. Tensile strength, bending/flexural strength, microhardness, electrical resistivity, fractography, optical microstructures, SEM microstructures, and EDS analysis were used to compare CSES solder joints with CSI solder joints. The salt spray test (SST) was used for corrosion analysis of CSES and CSI solder joints. Experimental results reveal that the tensile response, bending strength, and microhardness of the CSES solder joints were almost equal to those of the CSI solder joints. It was observed that after corrosion, the tensile strength, bending strength, and microhardness for CSES and CSI solder joints reduced. CSES solder joints were found to be slightly better than CSI solder joints for electrical resistivity. Electrical resistivity for all the cases studied was found to increase slightly after corrosion. Interfacial integrity and effect of corrosion were clearly observed on CSES and CSI solder joint microstructures. The intermetallic compounds (IMC) formed in case of CSES solder joints were found to be having slightly less thickness than that of CSI solder joints. The results demonstrate CSES technique as a green technology and a potential substitute to the CSI method.

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“…The evolution and growth of interfacial IMCs significantly affect the mechanical properties and reliability of solder joints due to the intrinsically brittle nature of IMCs [6][7][8]. In our previous study [9], we found that the fast growth of interfacial IMCs in Sn-3Ag-0.5Cu solder joints was responsible for the early formation of cracks at the Sn-3Ag-0.5Cu solder/IMC layer interface under extreme temperature thermal shock from −196 • C to 150 • C, and the growth of interfacial IMCs and crack formation at the IMC layer/solder interface led to the reduction in pull strength of Sn-3Ag-0.5Cu solder joints. Sn-Pb solder alloys are commonly used in deep space application until now [10].…”

Section: Introductionmentioning

confidence: 95%

Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock

et al. 2018

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Solder joints in thermally uncontrolled microelectronic assemblies have to be exposed to extreme temperature environments during deep space exploration. In this study, extreme temperature thermal shock test from −196 °C to 150 °C was performed on quad flat package (QFP) assembled with Sn-37Pb solder joints to investigate the evolution and growth behavior of interfacial intermetallic compounds (IMCs) and their effect on the pull strength and fracture behavior of Sn-37Pb solder joints under extreme temperature environment. Both the scallop-type (Cu, Ni)6Sn5 IMCs at the Cu lead side and the needle-type (Ni, Cu)3Sn4 IMCs at the Ni-P layer side changed to plane-type IMCs during extreme temperature thermal shock. A thin layer of Cu3Sn IMCs was formed between the Cu lead and (Cu, Ni)6Sn5 IMC layer after 150 cycles. The growth of the interfacial IMCs at the lead side and the Ni-P layer side was dominated by bulk diffusion and grain-boundary diffusion, respectively. The pull strength was reduced about 31.54% after 300 cycles. With increasing thermal shock cycles, the fracture mechanism changed from ductile fracture to mixed ductile–brittle fracture, which can be attributed to the thickening of the interfacial IMCs, and the stress concentration near the interface caused by interfacial IMC growth.

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Growth behavior of intermetallic compounds and early formation of cracks in Sn-3Ag-0.5Cu solder joints under extreme temperature thermal shock

Cited by 91 publications

References 32 publications

Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics

Progress in wafer bonding technology towards MEMS, high-power electronics, optoelectronics, and optofluidics

Microstructure, Mechanical, and Electrical Properties and Corrosion Analysis of Lead‐Free Solder CSI Joints on Cu Substrate Using Novel Concentrated Solar Energy Soldering (CSES) Method

Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock

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