Grey scale structures formation in SU-8 with e-beam and UV

Kudryashov, V. A.; Yuan, Xiaocong; Cheong, Wai Chye; Radhakrishnan, K.

doi:10.1016/s0167-9317(03)00083-2

Cited by 77 publications

(47 citation statements)

References 8 publications

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“…Three-dimensional photolithography using a gray-scale mask [27][28][29][30][31][32][33][34][35][36] is capable of realizing structures with a higher vertical resolution than multipleexposure photolithography while still using conventional photolithography tools.…”

Section: Gray-scale Masksmentioning

confidence: 99%

“…Therefore, the UV transmission pattern controls the dose delivered to the photoresist. The mechanism to control the UV intensity gradient in gray-scale photolithography varies with each technique and has been demonstrated with pixelated [27][28][29][30][31][32][33] and continuous-tone [34,35] optical masks. Pixelated gray-scale masks use diffraction through many sub-resolution pixels to control the UV dose.…”

Section: Gray-scale Masksmentioning

confidence: 99%

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Double-Exposure Grayscale Photolithography

Mosher

Waits

Morgan

et al. 2009

J. Microelectromech. Syst.

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Three-dimensional (3D) photoresist structures may be realized by controlling the transmitted UV light intensity in a process termed gray-scale photolithography.Light modulation is accomplished by diffraction through sub-resolution pixels on a photomask. The number of photoresist levels is determined by the number of different pixel sizes on the mask, which is restricted by mask fabrication. This drawback prevents the use of gray-scale photolithography for applications that need a high vertical resolution.The double-exposure gray-scale photolithography technique was developed to improve the vertical resolution without increasing the number of pixel sizes. This is achieved by using two gray-scale exposures prior to development. The resulting overlay produces an exposure dose that is a combination of both exposures.Calibration is utilized to relate the pixel sizes and exposure times to the photoresist height. This calibration enables automated mask design for arbitrary 3D structures and investigation of other effects, such as misalignment between the exposures.

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Section: Gray-scale Masksmentioning

confidence: 99%

Section: Gray-scale Masksmentioning

confidence: 99%

Double-Exposure Grayscale Photolithography

Mosher

Waits

Morgan

et al. 2009

J. Microelectromech. Syst.

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show abstract

“…Due to the emission properties of most semiconductor quantum dots, such processing has to be performed at low cryogenic temperatures or even liquid helium (l-He) temperature for sufficient signal-to-noise ratio 6 . Naturally, EBL is the most attractive technique to fabricate very precise or even three dimensional device structures with flexible design [7][8][9][10] . This initiates the quest for a detailed understanding of low-temperature-capable electron-beamsensitive resists 11 .…”

Section: Introductionmentioning

confidence: 99%

CSAR 62 as negative-tone resist for high-contrast e-beam lithography at temperatures between 4 K and room temperature

Kaganskiy¹,

Heuser²,

Schmidt³

et al. 2016

Journal of Vacuum Science &Amp; Technology B, Nanotechnology and Microelectronics: Materials, Processing, Measurement, and Phen

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The temperature dependence of the electron-beam sensitive resist CSAR 62 is investigated in its negative-tone regime. The writing temperatures span a wide range from 4 K to room temperature with the focus on the liquid helium temperature regime. The importance of low temperature studies is motivated by the application of CSAR 62 for deterministic nanophotonic device processing by means of in-situ electron-beam lithography. At low temperature, CSAR 62 exhibits a high contrast of 10.5 and a resolution of 49 nm. The etch stability is almost temperature independent and it is found that CSAR 62 does not suffer from peeling which limits the low temperature application of the standard electron-beam resist PMMA. As such, CSAR 62 is a very promising negative-tone resist for in-situ electron-beam lithography of high quality nanostructures at low temperature.

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“…Different lithographic techniques have been utilized to fabricate complex 3D structures, e.g. grey tone photolithography [1], electron beam lithography (EBL) [2], two-photon lithography [3], X-ray lithography [4], laser beam lithography [5] and nano-imprint lithography [6]. By employing these techniques, complex 3D shapes can be fabricated in resists.…”

Section: Introductionmentioning

confidence: 99%

Practical Surface Sculpting Method for the Fabrication of Predefined Curved Structures using Focused Ion Beam

Kim¹

2016

Applied Science and Convergence Technology

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Surface erosion using focused ion beam irradiation is the most promising technology for the realization of micro/nanofabrication. However, accurate fabrication of predefined structures is still challenging. This article introduces a single step surface driving method to fabricated predefined curved structures. The previously reported multi step surface driving method (MSDM) has been modified so that a single ion dose profile can be used instead of multiple ion dose profiles. Experimental realization of the method is presented with the fabrication of predefined curved surfaces as well as reference to surface propagation theory. For the purpose of verification, simulations are performed on the basis of a sound mathematical model.

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Grey scale structures formation in SU-8 with e-beam and UV

Cited by 77 publications

References 8 publications

Double-Exposure Grayscale Photolithography

Double-Exposure Grayscale Photolithography

CSAR 62 as negative-tone resist for high-contrast e-beam lithography at temperatures between 4 K and room temperature

Practical Surface Sculpting Method for the Fabrication of Predefined Curved Structures using Focused Ion Beam

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