Grain boundary effects on the mechanical properties of bismuth nanostructures

Burek, Michael J.; Jin, Sumin; Leung, Mason C.P.; Jahed, Zeinab; Wu, Jia-Han; Budiman, Arief Suriadi; Tamura, Nobumichi; Kunz, Martin; Tsui, Ting Y.

doi:10.1016/j.actamat.2011.04.017

Cited by 31 publications

(17 citation statements)

References 38 publications

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“…A great deal of recent work, as reviewed by Uchic et al, 1 Kraft et al, 2 and Greer and De Hosson, 3 has shown that the mechanical strength of single-crystalline face-centered cubic (FCC) [4][5][6][7][8][9][10][11][12] and body-centered cubic (BCC) [13][14][15][16][17] metals is strongly dependent on size, with reduced dimensions yielding stronger specimens. The same smaller-is-stronger effect has been observed in other crystalline systems, such as tetragonal, 18 rhombohedral, 19 and hexagonal close packed (HCP). [20][21][22][23][24][25][26] Size-dependent mechanical behaviors in nanoscale metals are generally attributed to the competition between the rate of dislocations generated by applied stress and the rate of dislocation annihilation at free surfaces.…”

Section: Introductionsupporting

confidence: 52%

Microstructure and mechanical properties of sub-micron zinc structures

et al. 2012

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The mechanical properties of submicron scale columnar zinc structures, with average diameters between 130 and 1060 nm, were characterized by uniaxial microcompression tests. The zinc pillars were fabricated by electron beam lithography and electroplating and were found to be generally single crystalline, with a preferred out-of-plane orientation close to the [0001] directions. Post deformation microstructural analysis suggests that the zinc pillars maintain their single-crystalline structure, but without twin boundary formation. Interestingly, the engineering flow stress results indicate that small-scale zinc structures are insensitive to both strain rate and size.

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Section: Introductionsupporting

confidence: 52%

Microstructure and mechanical properties of sub-micron zinc structures

et al. 2012

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“…[26][27][28] Polymethylmethacrylate (PMMA) thin films were first spin-coated onto titanium (~25 nm thick)-and gold (~25 nm thick)-coated silicon substrates. Via-hole patterns with various cross-sectional geometries were then created in the PMMA films by electron beam lithography.…”

Section: Experimental Methodsmentioning

confidence: 99%

Microstructural and Geometrical Effects on the Deformation Behavior of Sub-micron Scale Nanocrystalline Copper Pillars

Badami

Jahed

Seo

et al. 2015

Metall Mater Trans A

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The effects of microstructure, sample dimensions, and cross-sectional geometry on the deformation characteristics of electroplated nanocrystalline copper sub-micron pillars are investigated. Nanocrystalline copper pillars were produced with four types of geometry-solid core, hollow, c-shaped, and x-shaped-with outer diameters of~1000 or 220 nm and three different average grain sizes (between 5.1 and 49.3 nm). Flow stress results from uniaxial compression tests of 1000-and 220-nm-outer-diameter pillars, with average grain sizes in the range between~32 and 50 nm, revealed there are no observable strength dependences with the pillar cross-sectional geometries. This suggests that they behave with bulk-like character: mechanical properties independent of size and sample geometry. All of the pillar specimens examined exhibit an increase in mechanical strength with reduction of grain sizes, but soften as the crystalline dimensions are smaller than 10 to 20 nm threshold limits. Interestingly, pillars with outer diameters of 220 nm are distinctively softer than the 1000-nm-diameter samples when their grain size is at and below this threshold limit. These results indicate a strength specimen size effect exists for such fine grain copper pillars.

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“…Jang and Greer [21] reported a~40% reduction in mechanical strength of sub-micron nanocrystalline nickel-alloy columnar structures, when the column diameter is decreased from~2.5 μm to near 100 nm. Similarly, Burek et al [22] demonstrated that the presence of grain boundaries in bismuth sub-micron scale pillars also significantly reduces their mechanical strength. Investigation into the small-scale mechanics of other nanocrystalline metals, such as cobalt [23] and copper [24], revealed similar softening characteristics with shrinking exterior diameter of specimens.…”

Section: Introductionmentioning

confidence: 96%

Geometric effects on the mechanical strengths of strong nanocrystalline rhodium sub-micron structures

Tsui

Jahed

Evans

et al. 2014

Philosophical Magazine

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Sub-micron scale nanocrystalline rhodium pillars were fabricated by electron beam lithography and electroplating techniques. The fabricated specimens included solid core pillars and columnar structure with more complex crosssectional geometries, including x-shaped and annulus shaped. Among these specimens, two groups of sub-micron scale annulus structures with sidewall thicknesses of 250 and 205 nm were fabricated. All of the structures have outer diameters of~1 μm and consist of average grain size smaller than 22 nm. Uniaxial compression results reveal these rhodium pillars are very strong with true flow stresses exceeding 5 GPa and are not sensitive to the sample cross-sectional geometries.

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Grain boundary effects on the mechanical properties of bismuth nanostructures

Cited by 31 publications

References 38 publications

Microstructure and mechanical properties of sub-micron zinc structures

Microstructure and mechanical properties of sub-micron zinc structures

Microstructural and Geometrical Effects on the Deformation Behavior of Sub-micron Scale Nanocrystalline Copper Pillars

Geometric effects on the mechanical strengths of strong nanocrystalline rhodium sub-micron structures

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