Microstructure and mechanical properties of sub-micron zinc structures

Abstract

The mechanical properties of submicron scale columnar zinc structures, with average diameters between 130 and 1060 nm, were characterized by uniaxial microcompression tests. The zinc pillars were fabricated by electron beam lithography and electroplating and were found to be generally single crystalline, with a preferred out-of-plane orientation close to the [0001] directions. Post deformation microstructural analysis suggests that the zinc pillars maintain their single-crystalline structure, but without twin boundary formation. Interestingly, the engineering flow stress results indicate that small-scale zinc structures are insensitive to both strain rate and size.

Synthesis of [13C4]‐labeled 2′‐deoxymugineic acid

“…Several enantioselective syntheses for L-azetidine carboxylic acid [15][16][17] and L-allylglycine [18][19][20][21] were reported, some of which allow their preparation with 13 C-labeled carboxylic acid moieties from relatively cheap starting materials. The choice of this synthetic route was further appealing as isotopically labeled versions of L-azetidine carboxylic acid and L-allylglycine are expected to find applications of their own as both are building blocks of various pharmacologically active compounds (see [22][23][24] and 21,25-28 , respectively). The (additional) use of 13 C 4 -malic acid as starting material was not pursued due to its significantly higher cost.…”

Room-temperature oxygen vacancy migration induced reversible phase transformation during the anelastic deformation in CuO

“…In what follows, with the joint efforts of advanced electron microscopy [15][16][17][18][19][20][21][22][23][24][25][26] and first-principles calculations 27,28 , we elucidate the oxygen vacancy migration-mediated anelasticity in single crystalline CuO NWs. Atomistic structural characterization reveals that the bending stress-induced vacancy clustering stimulates the nucleation of metastable CuO x phase, which gradually transforms back to CuO after removal of the bending load.…”