Glass Frit as a Hermetic Joining Material for Bonding among Three Wafers with Metallic Film Feed-Through

Zhao, Cong; Wang, Jian; Zhang, Shi Ming; Zou, Jiang

doi:10.4028/www.scientific.net/kem.609-610.489

Cited by 4 publications

(2 citation statements)

References 3 publications

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“…The hermeticity is usually achieved by using various sealing methods, such as thermocompression bonding [5][6][7], soldering [8][9][10], glass frit bonding [11,12], seam welding [13] and anodic bonding [14,15]. Among these methods, the Au-Sn eutectic soldering technology is one of the widely used hermetic seal methods due to its favorable mechanical strength, flux-free process, and hermeticity [16,17].…”

Section: Introductionmentioning

confidence: 99%

A new hermetic sealing method for ceramic package using nanosilver sintering technology

Zhang

Liu

Wang

et al. 2018

Microelectronics Reliability

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High reliable packaging materials are needed for electronics when they work at harsh environments. Among which, the nanosilver material has been widely studied and applied in power electronics due to its low processing temperature and high reliability. This paper investigates the bonding properties of nanosilver sintered hermetic cavity. There are two kinds of lids used in this study, including copper lid and silicon lid. The X-Ray and C-Mode Scanning Acoustic Microscopy (C-SAM) results revealed that delamination tended to happen in Cu lid sintered cavity as the recovery of deformed Cu lid was hindered by sintered dense Ag layer. However, no delamination or cracks were found in Si lid sintered cavity. Finite element analysis (FEA) method was used to investigate the effects of lid materials on the stress distribution of lid. The results indicated that the Cu lid sintered cavity showed a much higher stress than the Si lid sintered cavity under the sintering parameters of 250C and 10 MPa. There is no obvious change in the stress distribution areas on Cu lid with the increasing of pressures from 5 to 30 MPa. However, the distribution area of stress on Si lid expanded obviously only when the sintering pressure increased to 30 MPa. With the increase of sintering pressures from 5 to 30 MPa, the maximum stresses on Cu lid are almost the same, while increasing trend was found on Si lid.

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Section: Introductionmentioning

confidence: 99%

A new hermetic sealing method for ceramic package using nanosilver sintering technology

Zhang

Liu

Wang

et al. 2018

Microelectronics Reliability

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“…The back cavity structure includes a trench which could avoid the contact between the quartz resonator and the structure. The three parts of pressure sensing element are bonded together using glass frit under low temperature and vacuum condition forming a vacuum cavity [4]. The glass frit bonding between bosses and DEFT resonator could obtain lower hysteresis error and higher stability compared with epoxy resin adhesive.…”

Section: Device Designmentioning

confidence: 99%

High Accuracy MEMS Pressure Sensor Based on Quartz Crystal Resonator

Wang

Zhao

Han

et al. 2017

Proceedings of Eurosensors 2017, Paris, France, 3–6 September 2017

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This paper reports a high accuracy oil-filled MEMS absolute pressure sensor based on quartz crystal double-ended tuning fork (DETF) resonator, which is suitable for application in ocean, petroleum, meteorological, aerospace and spacecraft field, etc. The pressure sensing unit is mainly composed of DETF resonator, diaphragm and back cavity structure. These pieces are all fabricated by quartz crystal using MEMS process, and are bonded together as 'sandwich' structure to form the absolute pressure sensing unit using glass frit under low temperature and vacuum condition. This process could effectively eliminate the thermal stress effect and form the reference vacuum cavity. The isolated packaged pressure sensor is composed of corrugated stainless steel diaphragm, silicone oil, pressure sensing unit and ceramic base package. The experimental results show that the accuracy is up to ±0.033% FS in the pressure range 0~300 kPa over the temperature range −20 °C~+45 °C.

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All-Quartz High Accuracy MEMS Pressure Sensor Based on Double-Ended Tuning Fork Resonator

Wang¹,

Zhao²,

Zhao³

et al. 2015

Procedia Engineering

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This paper reports an all-quartz high accuracy MEMS absolute pressure sensor based on high Q double-ended tuning fork (DETF) resonator, which is suitable for application in automotive, petroleum, meteorological, aerospace and spacecraft field. etc. The main parts of the MEMS pressure sensor, including the DETF resonator, diaphragm and back cavity structure, are all fabricated by quartz crystal using MEMS process. These pieces are bonded together as 'sandwich' structure to form the absolute pressure sensing unit using glass paste under low temperature and vacuum condition. This process could effectively eliminate the thermal stress effect and form the reference vacuum cavity. The experimental results show that the quality factor of the DETF resonator is up to 61000, the sensitivity is up to 7.35Hz/kPa in the operating range 0~250kPa, the pressure error is only 0.021%FS over the temperature range -40 ~+60 .

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Glass Frit as a Hermetic Joining Material for Bonding among Three Wafers with Metallic Film Feed-Through

Cited by 4 publications

References 3 publications

A new hermetic sealing method for ceramic package using nanosilver sintering technology

A new hermetic sealing method for ceramic package using nanosilver sintering technology

High Accuracy MEMS Pressure Sensor Based on Quartz Crystal Resonator

All-Quartz High Accuracy MEMS Pressure Sensor Based on Double-Ended Tuning Fork Resonator

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