A new hermetic sealing method for ceramic package using nanosilver sintering technology

Abstract

High reliable packaging materials are needed for electronics when they work at harsh environments. Among which, the nanosilver material has been widely studied and applied in power electronics due to its low processing temperature and high reliability. This paper investigates the bonding properties of nanosilver sintered hermetic cavity. There are two kinds of lids used in this study, including copper lid and silicon lid. The X-Ray and C-Mode Scanning Acoustic Microscopy (C-SAM) results revealed that delamination tended to happen in Cu lid sintered cavity as the recovery of deformed Cu lid was hindered by sintered dense Ag layer. However, no delamination or cracks were found in Si lid sintered cavity. Finite element analysis (FEA) method was used to investigate the effects of lid materials on the stress distribution of lid. The results indicated that the Cu lid sintered cavity showed a much higher stress than the Si lid sintered cavity under the sintering parameters of 250C and 10 MPa. There is no obvious change in the stress distribution areas on Cu lid with the increasing of pressures from 5 to 30 MPa. However, the distribution area of stress on Si lid expanded obviously only when the sintering pressure increased to 30 MPa. With the increase of sintering pressures from 5 to 30 MPa, the maximum stresses on Cu lid are almost the same, while increasing trend was found on Si lid.

A new method for preventing stress cracking in repairable ceramic packages by changing the sealing ring shape

“…An organic sealed package will be ultimately intruded by water vapor or gases due to the permeability of organic materials [1]. Active devices in harsh environments are preferentially recommended in a metal or ceramic hermetic package [2][3][4]. Sealing a package with a lid, usually the final process in packaging, allows an integrated circuit assembled inside in an isolated environment to prevent aggression of contaminants.…”

Investigation of Adhesive’s Material in Hermetic MEMS Package for Interfacial Crack between the Silver Epoxy and the Metal Lid during the Precondition Test

“…The results revealed that thermal cycling, high-temperature storage, high-humidity storage, and a pressure cooker test failed to induce failure. Zhang et al [ 3 ] investigated the bonding strength of a nanosilver sintered hermetic cavity with copper and silicon lids. Their results showed that the copper lid suffered delamination in the bonding layer, whereas the silicon lid exhibited great bonding quality.…”

“…Farisi et al [4] developed a low-temperature wafer-level hermetic packaging technology based on thermal compression bonding. Their analyses revealed that the bonding shear strength of the newly proposed technology exceeded 100 MPa and its leak rate was below 1.67 × 10 −15 Pa•m 3 •s −1 . Huang et al [5] also developed low-cost and low-temperature hermetic technology based on a eutectic PbSn solder and Cr/Ni/Cu bonding pad.…”

Microstructure evolution of Au/SnSb-CuNiAg/(Au)Ni during high temperature aging

“…At present, the development of packaging solders for the third generation of semiconductors, and the development of new leadfree interconnection technologies are getting more and more attention (Cheng et al, 2013). New lead-free interconnect technologies include sintering of Ag powder (Zhang et al, 2018(Zhang et al, , 2019Liu et al, 2018) and low-temperature diffusion of precious metals (Yoon and Lee, 2018;Wei et al, 2018;Peng et al, 2018). These processes can obtain good connection and be environmental friendly, but the process is complicated and the cost is high.…”