Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications

Watanabe, Atom O.; Ali, Muhammad; Zhang, Rui; Ravichandran, Siddharth; Kakutani, Takenori; Raj, P. Markondeya; Tummala, Rao; Swaminathan, Madhavan

doi:10.1109/ectc32862.2020.00027

Cited by 32 publications

(13 citation statements)

References 21 publications

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“…Tsai et al reported an antenna-integrated wafer-level package with a size of 10×10×0.5 mm 3 , which shows an antenna-array gain of 14.7 dBi at the 60 GHz band [100]. In addition to the wafer-level packaging, several R&D teams from industry and academic research groups are investigating the potential of fanout panel-level packaging (FOPLP) with organic substrates or glass substrates [90], [101] for 5G and radar communications.…”

Section: Antenna Systems In Package (Aip)mentioning

confidence: 99%

A Review of 5G Front-End Systems Package Integration

Watanabe

Ali

Sayeed

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

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145

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Increasing data rates, spectrum efficiency and energy efficiency have been driving major advances in the design and hardware integration of RF communication networks. In order to meet the data rate and efficiency metrics, 5G networks have emerged as a follow-on to 4G, and projected to have 100X higher wireless date rates and 100X lower latency than those with current 4G networks. Major challenges arise in the packaging of radio-frequency front-end modules because of the stringent low signal-loss requirements in the millimeter-wave frequency bands, and precision-impedance designs with smaller footprints and thickness. Heterogeneous integration in 3D ultra-thin packages with higher component densities and performance than with the existing 2D packages is needed to realize such 5G systems. This paper reviews the key building blocks of 5G systems and the underlying advances in packaging technologies to realize them.

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Section: Antenna Systems In Package (Aip)mentioning

confidence: 99%

A Review of 5G Front-End Systems Package Integration

Watanabe

Ali

Sayeed

et al. 2021

IEEE Trans. Compon., Packag. Manufact. Technol.

Self Cite

145

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“…A comparison with the similar reported work at 28 GHz is presented in Table 1. The work reported in [4,5,19] uses multiple RDLs and double molding layers in comparison to this work which uses 2 × RDLs and a single molding compound. Moreover, this work demonstrates the beam-steering in ± 35°in the azimuth plane.…”

Section: Discussionmentioning

confidence: 99%

28 GHz compact dipole antenna array integrated in fan-out eWLB package

Aziz

Öjefors

et al. 2022

Int. J. Microw. Wireless Technol.

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In this paper, we present a 28 GHz antenna array in package which covers the n257 and n258 frequency bands designated for 5G applications. The dipole antenna array is placed on one of the two re-distribution layers in the fan-out eWLB (embedded Wafer Level Ball Grid Array) package. For TX and RX, separate but identical antenna arrays are placed on each side of the die. The paper presents a novel horn-shaped heatsink which not only dissipates the heat, but also improves the radiation performance. The four-elements dipole array has the impedance bandwidth of almost 6 GHz (24–30 GHz) and shows a maximum realized gain of 9.5 dBi. Beam-steering in ± 35 deg is achieved in the azimuth plane (H-plane) by providing different phases to the dipoles through the chip. The measurements nicely agree with the simulation results.

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“…Consequently, millions of nodes will be deployed, posing technological and production challenges that cannot be addressed through evolutionary solutions. A multidisciplinary revolutionary approach is instead required involving heterogeneous integration into 3D high density packages [6], as well as multichannel transceivers utilizing silicon technologies (SiGe or CMOS) [7]. With the proliferation of cells and the huge fronthaul data rate, wireless backhauling will be required in large scales.…”

Section: A Terrestrial Networkmentioning

confidence: 99%

“…Again, the reason can be found in the prohibitive fabrication costs of LTCC based AiPs for consumer electronics markets targeting especially low-cost mass production. In recent years, glass-based AiPs have increasingly gained attention for mm-wave applications [6], [106], [107], [109], [125], [126], [127]. The advantage of the glass substrates are their low-loss electrical properties beyond 150 GHz, dimensional stability, ability to form fine-pitch lines, spaces, and vias, and potential availability in large-scale low-cost panels [45].…”

Section: A Integration Optionsmentioning

confidence: 99%

Electronically Steerable Antennas for Future Heterogeneous Communication Networks: Review and Perspectives

et al. 2022

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Satellite, fifth generation (5G), and sixth generation (6G) mobile communication systems operating at micro-and millimeter wave frequencies are an essential pillar in advanced network architectures for high-throughput low latency services. The decisive factors for this current development were the significant technological advances accomplished over the last two decades, which meanwhile enable highly integrated, feature-rich, and cost-effective realizations of complete phased array transceiver topologies. Motivated through the today's trend for heterogeneous constellation types to provide truly global coverage, this contribution reviews the current state-of-the-art of electronically steerable antennas for terrestrial and non-terrestrial communication systems up to 100 GHz. First, the potential benefits and limitations of the most relevant technologies are contrasted and put into context with recent system architectures for adaptive beamforming. Their operating principles along with various experimental implementation and achievements providing advanced capabilities such as multi-band/multi-beam operation, polarization agility, and wideangle scanning are thoroughly presented. Particular emphasis is laid on the review of direct radiating arrays, quasi-optical antenna configurations, and metasurface-based antennas.INDEX TERMS Satellite communications on the move (SOTM), fifth generation (5G), sixth generation (6G), hybrid satellite constellations, aerial networks, electronic steering, phased array, antennas.This article has been accepted for inclusion in a future issue of this journal. Content is final as presented, with the exception of pagination. TOBIAS CHALOUN (Member, IEEE) received the Dipl.-Ing. degree and the Dr.-Ing. degree (with hons.

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Glass-Based IC-Embedded Antenna-Integrated Packages for 28-GHz High-Speed Data Communications

Cited by 32 publications

References 21 publications

A Review of 5G Front-End Systems Package Integration

A Review of 5G Front-End Systems Package Integration

28 GHz compact dipole antenna array integrated in fan-out eWLB package

Electronically Steerable Antennas for Future Heterogeneous Communication Networks: Review and Perspectives

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