28 GHz compact dipole antenna array integrated in fan-out eWLB package

Abstract

In this paper, we present a 28 GHz antenna array in package which covers the n257 and n258 frequency bands designated for 5G applications. The dipole antenna array is placed on one of the two re-distribution layers in the fan-out eWLB (embedded Wafer Level Ball Grid Array) package. For TX and RX, separate but identical antenna arrays are placed on each side of the die. The paper presents a novel horn-shaped heatsink which not only dissipates the heat, but also improves the radiation performance. The four-elements dipole array has the impedance bandwidth of almost 6 GHz (24–30 GHz) and shows a maximum realized gain of 9.5 dBi. Beam-steering in ± 35 deg is achieved in the azimuth plane (H-plane) by providing different phases to the dipoles through the chip. The measurements nicely agree with the simulation results.

Structural Enhancement and Thermal Deformation Analysis of Antenna Arrays in Vehicle-Mounted Phased Array Radar: A Heat Dissipation Perspective

“…Traditional analytical tools and techniques are consistently found wanting when confronted with the multi-dimensional challenges presented by these systems. In a similar vein, current techniques deployed for thermal deformation prediction have come under scrutiny for their perceived rigidity and lack of precision, thereby curtailing the broader applicability of these advanced radar systems [20,21].…”