Generation of debris in the femtosecond laser machining of a silicon substrate

Matsumura, Tomotake; Kazama, Atsushi; Yagi, Takashi

doi:10.1007/s00339-004-3192-y

Cited by 41 publications

(19 citation statements)

References 15 publications

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“…6.37 Â 10 À 4 and 7.64 Â 10 À 3 J/mm 2 ), except for the removal of few materials. A small amount of ablated debris scattered around the irradiated areas, which originated from the atoms and clusters due to the Coulomb explosion [27]. With increasing laser fluence, cylindrical holes were observed, with bottom completely covered with "pine cortex" heaves.…”

Section: The Blind Holes (Or Circular Surfaces)mentioning

confidence: 96%

Micromachining features of TiC ceramic by femtosecond pulsed laser

Zhang

Wang

Zhang

et al. 2015

Ceramics International

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Section: The Blind Holes (Or Circular Surfaces)mentioning

confidence: 96%

Micromachining features of TiC ceramic by femtosecond pulsed laser

Zhang

Wang

Zhang

et al. 2015

Ceramics International

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“…However, redeposition in powder form along the cut was observed. Work by Matsumura et al [26] compared femtosecond laser machining of a silicon substrate in gas environment (Ar, He and N 2 ) and in vacuum. They reported that the machining process also produced a significant amount of debris in the gas environment whereas no debris were found in vacuum.…”

Section: Approach In Preventing Recast and Debris Formationmentioning

confidence: 99%

Underwater femtosecond laser micromachining of thin nitinol tubes for medical coronary stent manufacture

Muhammad

2012

Appl. Phys. A

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Microprofiling of medical coronary stents has been dominated by the use of Nd:YAG lasers with pulse lengths in the range of a few milliseconds, and material removal is based on the melt ejection with a high-pressure gas. As a result, recast and heat-affected zones are produced, and various post-processing procedures are required to remove these defects. This paper reports a new approach of machining stents in submerged conditions using a 100-fs pulsed laser. A comparison is given of dry and underwater femtosecond laser micromachining techniques of nickeltitanium alloy (nitinol) typically used as the material for coronary stents. The characteristics of laser interactions with the material have been studied. A femtosecond Ti:sapphire laser system (wavelength of 800 nm, pulse duration of 100 fs, repetition rate of 1 kHz) was used to perform the cutting process. It is observed that machining under a thin water film resulted in no presence of heat-affected zone, debris, spatter or recast with fine-cut surface quality. At the optimum parameters, the results obtained with dry cutting showed nearly the same cut surface quality as with cutting under water. However, debris and recast formation still appeared on the dry cut, which is based on material vaporization. Physical processes involved during the cutting process in a thin water film, i.e. bubble formation and shock waves, are discussed. N. Muhammad · L. Li ( ) Laser

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“…The problem however is that during laser patterning graphene forms folds [27] and debris causing disturbance resulting in unwanted defects and negative impact on its application as transistor electrodes. Femtosecond laser ablation of graphene in vacuum, compared to air, should result in cleaner and more controlled patterning of the layer because rather less material is redeposited on the substrate [28][29][30]. Moreover, atmospheric oxygen can oxidize the remaining graphene upon laser ablation and reduce performance of graphenebased electronics.…”

Section: Introductionmentioning

confidence: 99%

Femtosecond laser patterning of graphene electrodes for thin-film transistors

Kasischke

Subaşı

Bock

et al. 2019

Applied Surface Science

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Email address: kasischke@lat.rub.de (Maren Kasischke) The aim of this study is to assess femtosecond laser patterning of graphene in air and in vacuum for the application as source and drain electrodes in thin-film transistors (TFTs). The analysis of the laser-patterned graphene with scanning electron microscopy, atomic force microscopy and Raman spectroscopy showed that processing in vacuum leads to less debris formation and thus re-deposited carbonaceous material on the sample compared to laser processing in air. It was found that the debris reduction due to patterning in vacuum improves the TFT characteristics significantly. Hysteresis disappears, the mobility is enhanced by an order of magnitude and the subthreshold swing is reduced from S sub = 2.5 V/dec to S sub = 1.5 V/dec.

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Generation of debris in the femtosecond laser machining of a silicon substrate

Cited by 41 publications

References 15 publications

Micromachining features of TiC ceramic by femtosecond pulsed laser

Micromachining features of TiC ceramic by femtosecond pulsed laser

Underwater femtosecond laser micromachining of thin nitinol tubes for medical coronary stent manufacture

Femtosecond laser patterning of graphene electrodes for thin-film transistors

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