Gain-Enhanced On-Chip Folded Dipole Antenna Utilizing Artificial Magnetic Conductor at 94 GHz

Nafe, Mahmoud; Syed, Ali; Shamim, Atif

doi:10.1109/lawp.2017.2749308

Cited by 54 publications

(32 citation statements)

References 12 publications

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“…More specifically, boresight gain is 3.8 dB higher and relative size is half in one dimension and quarter in other dimension in comparison to [7]. Similarly, gain of current work is 0.8 dB higher with considerably smaller area than [5].…”

Section: Fabrication and Measurementsmentioning

confidence: 68%

“…Benchmarks used are frequency range, size, peak bore-sight gain and AMC gain. It can be seen that the gain is higher with smaller foot-print as compared to [5], [7]. More specifically, boresight gain is 3.8 dB higher and relative size is half in one dimension and quarter in other dimension in comparison to [7].…”

Section: Fabrication and Measurementsmentioning

confidence: 91%

“…The subset terminologies of this broader connotation include: high impedance surfaces (HIS), frequency selective surfaces (FSS), artificial magnetic conductors (AMC), Negative refractive index (NRI) materials etc. In [5], an AMC backed dipole OCA is presented in which ground plane of AMC is at M1 which is the lowest metal layer in a standard CMOS process. This approach isolates the digital circuitry of the chip completely from antenna radiation; thereby increasing the gain and minimizing the EMC issues.…”

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

A W-Band EBG-Backed Double-Rhomboid Bowtie-Slot On-Chip Antenna

Khan

Tahir

Meredov

et al. 2019

Antennas Wirel. Propag. Lett.

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A double-rhomboid bowtie-slot on-chip antenna aided by a back-to-back E-shaped electromagnetic band-gap surface for gain enhancement at W-band is presented. The specific structure of both, the antenna and the EBG surface is being reported for the first time in an on-chip implementation. The antenna is analyzed independently as well as backed by different electromagnetic band-gap reflective surfaces using standard 0.13 µm BiCMOS process. The proposed EBG surface provides a measured gain enhancement of 2 dB and 8 dB when used as a frequency selective surface and as an articial magnetic conductor, respectively. With an overall chip-size of 1×1 mm 2 , the on-chip antenna demonstrates a-6 dB impedance bandwidth from 75-100 GHz and an effective gain bandwidth from 80-90 GHz with a peak measured gain of-0.58 dBi at 84 GHz. The antenna has the smallest reported size and the highest gain in W-Band with artificial magnetic conductor as reflective surface.

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Section: Fabrication and Measurementsmentioning

confidence: 68%

Section: Fabrication and Measurementsmentioning

confidence: 91%

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

A W-Band EBG-Backed Double-Rhomboid Bowtie-Slot On-Chip Antenna

Khan

Tahir

Meredov

et al. 2019

Antennas Wirel. Propag. Lett.

Self Cite

View full text Add to dashboard Cite

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“…This will effectively create multiple frequency bands. Meta-surfaces such as an Artificial Magnetic Conductor (AMC), which are periodic structures of elements can be designed in conjunction with the antennas to enhance the transmission of the on-chip antennas as well [59][60][61]. These structures can be used to reflect the antenna transmission outside the die reducing energy In addition to the above antenna designs, novel techniques can be used to enhance various aspects of the antenna characteristics.…”

Section: High-bandwidth Antennasmentioning

confidence: 99%

The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems

Ganguly

Ahmed

Narde

et al. 2018

JLPEA

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With aggressive scaling of device geometries, density of manufacturing faults is expected to increase. Therefore, yield of complex Multi-Processor Systems-on-Chips (MP-SoCs) will decrease due to higher probability of manufacturing defects especially, in dies with large area. Therefore, disintegration of large SoCs into smaller chips called chiplets will improve yield and cost of complex platform-based systems. This will also provide functional flexibility, modular scalability as well as the capability to integrate heterogeneous architectures and technologies in a single unit. However, with scaling of the number of chiplets in such a system, the shared resources in the system such as the interconnection fabric and memory modules will become performance bottlenecks. Additionally, the integration of heterogeneous chiplets operating at different frequencies and voltages can be challenging. State-of-the-art inter-chip communication requires power-hungry high-speed I/O circuits and data transfer over long wired traces on substrates. This increases energy consumption and latency while decreasing data bandwidth for chip-to-chip communication. In this paper, we explore the advances and the challenges of interconnecting a multi-chip system with millimeter-wave (mm-wave) wireless interconnects from a variety of perspectives spanning multiple aspects of the wireless interconnection design. Our discussion on the recent advances include aspects such as interconnection topology, physical layer, Medium Access Control (MAC) and routing protocols. We also present some potential paradigm-shifting applications as well as complementary technologies of wireless inter-chip communications.

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“…AMCs can also be used as a reflector, enabling low-profile antennas, as shown in [2][3][4]. The ability to create lowprofile antennas using AMCs has also received a lot of attention for Antenna-on-Chip (AoC) applications [5][6][7][8][9]. Roughly, two different methodologies can be identified in the current research on AMCs for AoC.…”

Section: Introductionmentioning

confidence: 99%

Assessment on the Bandwidth of Artificial Magnetic Conductors for Antenna-on-Chip Applications

Biggelaar

Johannsen

Smolders

2018

12th European Conference on Antennas and Propagation (EuCAP 2018)

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Gain-Enhanced On-Chip Folded Dipole Antenna Utilizing Artificial Magnetic Conductor at 94 GHz

Cited by 54 publications

References 12 publications

A W-Band EBG-Backed Double-Rhomboid Bowtie-Slot On-Chip Antenna

A W-Band EBG-Backed Double-Rhomboid Bowtie-Slot On-Chip Antenna

The Advances, Challenges and Future Possibilities of Millimeter-Wave Chip-to-Chip Interconnections for Multi-Chip Systems

Assessment on the Bandwidth of Artificial Magnetic Conductors for Antenna-on-Chip Applications

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