GaAs Mixed Signal Multi-Function X-Band MMIC with 7 Bit Phase and Amplitude Control and Integrated Serial to Parallel Converter

Boer, A. de; Mouthaan, Koen

doi:10.1109/euma.2000.338701

Cited by 39 publications

(17 citation statements)

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“…Enabling technologies for core-chip MMICs typically rely on GaAs-based integration, at least for X-band applications as considered in the present paper. The main goal of integrating part of the control logic within the core-chip MMIC is to drastically reduce the complexity of the routing from the central array control unit to the single element drivers, by feeding each core-chip with a low number of serial data streams, rather than with a large number of parallel data connection (that is a common used solution, see [1][2]): the serial to parallel conversion is performed aboard the core-chip itself (see [3] [4]). In fact, the solution exploiting parallel digital data inputs allows for simpler internal digital architectures, but is not practicable as soon as the number of bits exceeds a few units, or when the core-chip number within the system is of several hundreds, as for satellite SAR applications.…”

Section: Introductionmentioning

confidence: 99%

Compact GaAs HEMT D flip-flop for the integration of a SAR MMIC core-chip digital control logic

Ghione

Pirola

Quaglia

et al. 2010

2010 Workshop on Integrated Nonlinear Microwave and Millimeter-Wave Circuits

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The paper presents a novel, ultracompact, reduced-area implementation of a D-type flip-flop using the GaAs Enhancement-Depletion (ED) PHEMT process of the OMMIC with the gate metal layout modified, at the device process level. The D cell has been developed as the building block of a serial to parallel 13-bit shifter embedded within an integrated core-chip for satellite X band SAR applications, but can be exploited for a wide set of logical GaAs-based applications. The novel D cell design, based on the Enhancement-Depletion Super-Buffer (EDSB) logical family, allows for an area reduction of about 20%, with respect to the conventional design, and simplified interconnections. Design rules have been developed to optimize the cell performances. Measured and simulated NOR transfer characteristics show good agreement. A dedicated layout for RF probing has been developed to test the D-type flip-flop behaviour and performances.

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Section: Introductionmentioning

confidence: 99%

Compact GaAs HEMT D flip-flop for the integration of a SAR MMIC core-chip digital control logic

Ghione

Pirola

Quaglia

et al. 2010

2010 Workshop on Integrated Nonlinear Microwave and Millimeter-Wave Circuits

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“…최근 들 어 디지털 회로의 집적화에 장점을 가지는 BiCMOS 공정을 이용한 논문들도 등장하고 있다 [5], [6] . 하지만 RF 성능 면에서 BiCMOS 공정의 다기능 칩은 GaAs 공정의 칩을 따라 갈 수가 없으며, 현재 대부분의 [4] . 직병렬 변환기를 칩 내에 포함할 경우 제어 선로의 수가 바이어스 선로를 포함하여 앞서의 26개에서 6 개로 줄일 수 있다.…”

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A GaAs MMIC Multi-Function Chip with a Digital Serial-to-Parallel Converter for an X-band Active Phased Array Radar System

Jeong¹,

Shin²,

Ju³

et al. 2011

The Journal of Korean Institute of Electromagnetic Engineering

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An MMIC multi-function chip for an X-band active phased array radar system has been designed and fabricated using a 0.5 μm GaAs p-HEMT commercial process. A digital serial-to-parallel converter is included in this chip in order to reduce the number of the control interface. The multi-function chip provides several functions: 6-bit phase shifting, 6-bit attenuation, transmit/receive switching, and signal amplification. The fabricated multi-function chip with a relative compact size of 24 mm 2 (6 mm×4 mm) exhibits a transmit/receive gain of 24/15 dB and a P1dB of 21 dBm from 8.5 GHz to 10.5 GHz. The RMS errors for the 64 states of the 6-bit phase shift and attenuation were measured to 7° and 0.3 dB, respectively over the frequency.

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“…The adoption of the so-called "Core Chip" approach, practically consists in grouping all the main T/R modules' control and low level amplification functionalities in a single GaAs chip, resulting in a major breakthrough in terms of easy integration, size, and assembly criticalities. The highest level of integration achieved in a Core Chip design is in the digital control circuits implementation within RF analog blocks, forming mixed signal MMICs [3][4][5][6]. However, due both to the lack of p-type FETs and a native stable GaAs oxide, complementary devices are not available in GaAs technology.…”

Section: Introductionmentioning

confidence: 99%

Design and Realization of GaAs Digital Circuit for Mixed Signal MMIC Implementation in AESA Applications

Bentini

Pasciuto

Ciccognani

et al. 2011

International Journal of Microwave Science and Technology

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A complete design flow starting from the technological process development up to the fabrication of digital circuits is presented. The aim of this work is to demonstrate the GaAs Enhancement/Depletion (E/D) double stop-etch technology implementation feasibility for digital applications, aimed at mixed signal circuit integration. On the basis of the characterization of small E/D devices with different Gate peripheries, developed by the SELEX-SI foundry, and the analysis of several GaAs-based logical families, the most suitable logic for the available technology has been selected. Then, simple test vehicles (level shifters, NOR logic gates and D Flip-Flops) have been designed, realized, and measured to validate the design strategy applied to the GaAs E/D process. These logical circuits are preliminary to the design of a more complex serial-to-parallel converter, to be implemented onto the same chip together with RF analog blocks, such as stepped attenuators and phase shifters.

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GaAs Mixed Signal Multi-Function X-Band MMIC with 7 Bit Phase and Amplitude Control and Integrated Serial to Parallel Converter

Cited by 39 publications

References 0 publications

Compact GaAs HEMT D flip-flop for the integration of a SAR MMIC core-chip digital control logic

Compact GaAs HEMT D flip-flop for the integration of a SAR MMIC core-chip digital control logic

A GaAs MMIC Multi-Function Chip with a Digital Serial-to-Parallel Converter for an X-band Active Phased Array Radar System

Design and Realization of GaAs Digital Circuit for Mixed Signal MMIC Implementation in AESA Applications

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