IEEE 14th Topical Meeting on Electrical Performance of Electronic Packaging, 2005.
DOI: 10.1109/epep.2005.1563686
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Fully integrated AC coupled interconnect using buried bumps

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Cited by 10 publications
(8 citation statements)
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“…The other is the swing limited area, which is limited by small coupling capacitors or a longer T-line. For a detailed discussion of these trade-offs, refer to [5,7]. Simulations using a 90nm CMOS technology show operation up to 12.5Gb/s for T-line lengths of 10cm to 20cm using 100fF to 200fF coupling capacitors.…”
Section: Multi-channel Bus Test Setupmentioning
confidence: 98%
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“…The other is the swing limited area, which is limited by small coupling capacitors or a longer T-line. For a detailed discussion of these trade-offs, refer to [5,7]. Simulations using a 90nm CMOS technology show operation up to 12.5Gb/s for T-line lengths of 10cm to 20cm using 100fF to 200fF coupling capacitors.…”
Section: Multi-channel Bus Test Setupmentioning
confidence: 98%
“…The use of capacitively coupled I/O and pulse signaling was proposed as one solution to this problem and has been investigated by numerous groups [1][2][3][4][5][6]. Capacitive coupling can be created by using on-chip metal-insulator-metal (MIM) capacitors, as reported in this paper, or by creating an inter-chip/package capacitor as reported in [7]. Capacitive coupling has also been used in 3D-ICs stacks for inter-chip communication [2][3].…”
Section: Introductionmentioning
confidence: 99%
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