Free drop test simulation for portable IC package by implicit transient dynamics FEM

Irving, S.; Liu, Y.

doi:10.1109/ectc.2004.1319471

Cited by 42 publications

(10 citation statements)

References 2 publications

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“…Irving et al [84] established a nonlinear model subjected to free fall drop impact using the implicit-based transient dynamic analysis to investigate the dynamic responses of different IC package designs subjected to drop impact. Results showed that the stress wave propagation was predicted correctly; thus the implicit method can be relied upon to run a dynamic analysis.…”

Section: Methods Of Modeling Drop Impactmentioning

confidence: 99%

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

Yau¹,

Hua

2011

Applied Mechanics Reviews

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This article is dedicated to the review of publications on drop impact analysis performed on consumer electronic devices such as cellular phones and two-way radios in the past decade. Prior to the highlights of this review, the scope and motivation behind this work will be briefly explained. A comprehensive survey on published literatures devoted to the methodologies established to analyze the reliability of electronic products exposed to the event of drop impact is presented. The scope of the review is extended beyond product level analysis to also include drop impact study at board level. This type of review is novel and has not been published in the past. The focus will be on the different analytical and numerical modeling approaches and the current status of finite element method in predicting the drop impact performance of electronic devices. Of equal interest is the methodology adopted in past work to establish a correlation between numerical and experimental results. This article serves as a reference to all intended future work which could be an extension from the current known art of drop impact analysis on electronic devices. The time frame of this review is up to year 2010.

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Section: Methods Of Modeling Drop Impactmentioning

confidence: 99%

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

Yau¹,

Hua

2011

Applied Mechanics Reviews

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“…Mishiro et al evaluated the solder joint reliabilities of BGAs and chip size packages under drop impacts, and the authors found that the stress in a solder joint differs depending on the package structure, even if the motherboard strain is the same, and underfilling eases the motherboard strain and disperses the stress concentrated on a solder joint [7]. Irving and Liu studied the free drop test performance of portable IC package by implicit transient dynamics FEA, and the modeling results show that the higher the solder joints, the higher the impact stress [8]. To investigate the board level solder joint reliability performance during the drop test, Tee et al studied the comprehensive dynamic response of printed circuit board (PCB) and solder joints with a multichannel realtime electrical monitoring system, and simulated with a novel input acceleration method [9]- [11].…”

Section: Introductionmentioning

confidence: 97%

Effect of Thermal Aging on the Microstructure Evolution and Solder Joint Reliability in Hard Disk Drive Under Mechanical Shock

Chen

Wang

et al. 2008

IEEE Trans. Comp. Packag. Technol.

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The effect of thermal aging on the microstructure evolution and solder joint reliability in hard disk drive (HDD) under mechanical shock was investigated. Significant coarsening of Ag 3 Sn particles was found in SnAgCu solder, and AuSn 4 intermetallic compound (IMC) changed from needle-type to layer-type during aging. For as-soldered SnAgCu solder joints after mechanical shock, the cracks were initiated in AuSn 4 at the corner of the solder joints, and mainly propagated along the thin Ni 3 Sn 4 IMC layer. After aging at 150 C for 21 days, the cracks were mainly propagated along the solder, Ni 3 Sn 4 , Au-Sn-Ni-Cu, and Au-Cu-Sn. The significant coarsening of microstructure was found in SnPb solder joints, and only microcracks were found on the surfaces of as-soldered and aged solder joints after mechanical shock.Index Terms-Aging, hard disk drive (HDD), mechanical shock, solder joint reliability.

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“…The so-called input-G method has been widely adopted since it decouples the board finite element model from the system model [11]. There are several approaches in implementing the input-G method, such as explicit dynamics analysis using DYNA-3-D [12], large mass method with implicit dynamics [13], and the input-D method, in which the acceleration input is integrated twice to obtain the displacement boundary condition over time [14]. Mode superposition method is also applied effectively for a linear system under impact loading [15].…”

mentioning

confidence: 99%

Effects of Package Level Structure and Material Properties on Solder Joint Reliability Under Impact Loading

Fan

Ranouta

Dhiman

2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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In this paper, the effects of package level structures and material properties on solder joint reliability subjected to impact loading are investigated by the integrated experimental testing, failure analysis, and finite element modeling. Three different package structures: ball on I/O wafer level package (WLP), copper post WLP, and chip-scale (CS) ball grid array (BGA) package, are studied. Experimental testing based on JESD22-B111 is conducted to obtain the components' failure mode, rate, location, and the corresponding board strains and accelerations. Finite element models are developed and validated against the experimental results. For a CS BGA package, the compliance of the plastic substrate/mold compound provides a "stress buffer mechanism" at corner joints in BGA to relieve stresses. For a copper post (or pillar) WLP, wafer level epoxy, which encapsulates copper pillars, serves as a compliant layer for solder joint stress reduction under dynamic loading. Comprehensive data from simulation and experimental results show that package structure and material properties play a significant role on the dynamic responses of solder joints. The actual solder joint reliability performance of a CS BGA or WLP package depends on the resultant effects of package structure, material properties, package body size, and the component locations. Index Terms-Ball grid array (BGA), compliant layer, dynamics, finite element analysis (FEA), impact loading, JESD22-B111, reliability, solder joints, wafer level package (WLP).

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Free drop test simulation for portable IC package by implicit transient dynamics FEM

Cited by 42 publications

References 2 publications

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

Effect of Thermal Aging on the Microstructure Evolution and Solder Joint Reliability in Hard Disk Drive Under Mechanical Shock

Effects of Package Level Structure and Material Properties on Solder Joint Reliability Under Impact Loading

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