A Comprehensive Review of Drop Impact Modeling on Portable Electronic Devices

Abstract

This article is dedicated to the review of publications on drop impact analysis performed on consumer electronic devices such as cellular phones and two-way radios in the past decade. Prior to the highlights of this review, the scope and motivation behind this work will be briefly explained. A comprehensive survey on published literatures devoted to the methodologies established to analyze the reliability of electronic products exposed to the event of drop impact is presented. The scope of the review is extended beyond product level analysis to also include drop impact study at board level. This type of review is novel and has not been published in the past. The focus will be on the different analytical and numerical modeling approaches and the current status of finite element method in predicting the drop impact performance of electronic devices. Of equal interest is the methodology adopted in past work to establish a correlation between numerical and experimental results. This article serves as a reference to all intended future work which could be an extension from the current known art of drop impact analysis on electronic devices. The time frame of this review is up to year 2010.

Comparative Study on Reliability and Advanced Numerical Analysis of BGA Subjected to Product-Level Drop Impact Test for Portable Electronics

“…This is obviously because of the smaller deflection as compared to 0.6 mm thick PCB with fixture I. It should be noticed that the BGA package 3 is not included since it rarely fails within 1000 times of drop life due to smaller package size effect. Between BGA package 1 and 2 , package 2 has a lower drop reliability for all cases except for fixture III.…”

“…Because of the slim design, handheld devices are becoming more vulnerable in case of the drop. As electronic packages are also getting thinner, drop and vibration reliability concerns become increasingly more important [1][2][3][4][5]. Especially, interconnection structures of the IC (integrated circuit) packages are sensitive to drop impact conditions when PCB thickness is reduced.…”

Experimental Study on the Reliability of PBGA Electronic Packaging under Shock Loading

“…Zhang Jie and Yang Ping studied effects of PBGA components' structure factors such as parameters and material properties on the solder joint stress by a combination of analytical method and finite element analysis [20]. Yau, Y.H, Mattila, T.T and Zhang, B. studied the dynamic mechanism of electronic devices, board under the drop impact [21][22][23]. This paper uses the Input-G method to conduct shock test on PBGA packaging PCB in board level following the JEDEC (Joint Electron Device Engineering Councils) standard.…”

Fe2O3 Nanoparticles Anchored on the Ti3C2Tx MXene Paper for Flexible Supercapacitors with Ultrahigh Volumetric Capacitance

“…The advent of wearable electronics has dramatically stimulated the demand for flexible and miniaturized energy storage devices. − Supercapacitors, known for ultrafast charge–discharge ability and a long cycling life, − are viewed as an ideal power source for next-generation electronics. In practice, the volumetric capacitance of supercapacitors needs to be enhanced in a limited space. , Volumetric capacitance is defined as C v = C m ×ρ, where C v , C m , and ρ are the volumetric capacitance, gravimetric capacitance, and electrode tap density, respectively.…”