Abstract:The effect of thermal aging on the microstructure evolution and solder joint reliability in hard disk drive (HDD) under mechanical shock was investigated. Significant coarsening of Ag 3 Sn particles was found in SnAgCu solder, and AuSn 4 intermetallic compound (IMC) changed from needle-type to layer-type during aging. For as-soldered SnAgCu solder joints after mechanical shock, the cracks were initiated in AuSn 4 at the corner of the solder joints, and mainly propagated along the thin Ni 3 Sn 4 IMC layer. Afte… Show more
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