Formation, stability, and dissolution of clusters on electrodes monitored by in-situ STM

Breuer, N.; Stimming, Ulrich; Vogel, R.

doi:10.1016/0013-4686(95)00040-l

Cited by 13 publications

(5 citation statements)

References 20 publications

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“…Breuer, Stimming, and Vogel monitored the dissolution of Cu clusters deposited on polycrystalline Au electrodes using in situ STM . These authors observed that the presence of the STM tip slowed the degree of dissolutionin the same way the tip had inhibited the deposition of Cu onto this surface.…”

Section: A Coppermentioning

confidence: 99%

Electrochemical Applications ofin SituScanning Probe Microscopy

1997

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Section: A Coppermentioning

confidence: 99%

Electrochemical Applications ofin SituScanning Probe Microscopy

1997

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“…Copper nucleation and growth processes have been extensively studied on various single crystal substrates using in situ electrochemical scanning tunneling microscopy (STM) methods in order to identify nucleation behavior, growth modes and the factors that affect them. − Previous efforts to control copper film nanostructure have included the electrochemical deposition of nanoparticles onto ultrathin polypyrrole films deposited on gold film electrodes, where crystal size and number density were found to be dependent on the thickness of the gold and polypyrrole films, the applied potential, and electrolyte concentration . High-order hierarchical copper structures have also been fabricated electrochemically with the aid of surfactants .…”

Section: Introductionmentioning

confidence: 99%

Shape Control of Electrodeposited Copper Films and Nanostructures through Additive Effects

2014

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The use of electrolyte additives to affect nanocrystallite shape and film morphology in electrodeposited copper films is presented. Linear sweep and cyclic voltammetry, atomic force microscopy (AFM), scanning electron microscopy (SEM), and X-ray diffraction (XRD) methods are employed to investigate the effects of alcohol additives and the organic additive malachite green (MG), on copper electrodeposited onto polycrystalline gold electrodes. The use of additives affects the deposition process by increasing cathodic peak potentials and decreasing corresponding peak currents. Copper films deposited from electrolyte solutions with additives show additive-specific nanostructure and crystallite morphology. Film analysis reveals a greater than five times reduction in both film roughness and grain size in the presence of even small concentrations of the additive MG. Use of MG results in the preferential electrodeposition of oriented, square pyramidal crystallites, while alcohol additives result in tetrahedral crystallite textures. These shape-controlled additive effects are supported by additive adsorption energy calculations, which indicate preferential interactions, and differential growth kinetics on different facets of the film's growing nanostructures during electrodeposition. This approach offers a new and cost-effective route to achieve shape-controlled surface nanostructure.

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“…Scanning vibrating probe methods, the closely related scanning Kelvin probe technique, and the scanning reference electrode techniques are better suited for this purpose. ,− However, while providing quantitative spatiotemporally resolved data, their spatial resolution is rather low. More importantly, the presence of a (vibrating) scanning electrode in close distance to the analyzed surface often constitutes a strong perturbation to the system which complicates data analysis. − …”

Section: Introductionmentioning

confidence: 99%

“…More importantly, the presence of a (vibrating) scanning electrode in close distance to the analyzed surface often constitutes a strong perturbation to the system which complicates data analysis. [18][19][20] Here, we present a novel, noninvasive method based on simple optical microscopy for spatiotemporally resolved corrosion rate measurements in specially designed model systems. The spatial resolution is determined by the optical properties of the setup (i.e., the numerical aperture of the lens used for imaging).…”

Section: Introductionmentioning

confidence: 99%

Inhibition and Promotion of Copper Corrosion by CTAB in a Microreactor System

et al. 2008

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We report on an optical microscopy technique for the analysis of corrosion kinetics of metal thin films in microreactor systems and use it to study the role of cetyltrimethylammonium bromide surfactant as a corrosion inhibitor in a copper-gold galvanic coplanar microsystem. A minimum in the dissolution rate of copper is observed when the surfactant concentration is approximately 0.8 mM. To explain why the inhibitory role of the surfactant does not extend to higher concentrations, we use zero resistance ammetry with separated half cells and show that while the surfactant inhibits cathodic reactions on gold, it also promotes the corrosion of copper because of the catalytic action of bromide counterions. These two competing processes lead to the observed minimum in the dissolution rate.

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Formation, stability, and dissolution of clusters on electrodes monitored by in-situ STM

Cited by 13 publications

References 20 publications

Electrochemical Applications ofin SituScanning Probe Microscopy

Electrochemical Applications ofin SituScanning Probe Microscopy

Shape Control of Electrodeposited Copper Films and Nanostructures through Additive Effects

Inhibition and Promotion of Copper Corrosion by CTAB in a Microreactor System

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