“…This can be achieved by laser ablation of copper surfaces, 13,41 plasma etching, 19 dealloying, 30,31 electrochemical polishing, 53 thermal annealing, 54 or electrodeposition. 10,18,20,22,43,55,56 Gowthaman and John demonstrated that the applied substrate potential during Cu electrodeposition affects the geometry of the obtained deposit. They obtained cubic, spherical, dendritic and prickly CuNSs from the same solution.…”