2014
DOI: 10.1021/la500001j
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Shape Control of Electrodeposited Copper Films and Nanostructures through Additive Effects

Abstract: The use of electrolyte additives to affect nanocrystallite shape and film morphology in electrodeposited copper films is presented. Linear sweep and cyclic voltammetry, atomic force microscopy (AFM), scanning electron microscopy (SEM), and X-ray diffraction (XRD) methods are employed to investigate the effects of alcohol additives and the organic additive malachite green (MG), on copper electrodeposited onto polycrystalline gold electrodes. The use of additives affects the deposition process by increasing cath… Show more

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Cited by 34 publications
(23 citation statements)
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“…25 The inuence of the electrolyte additives on the shape and the morphology of nanocrystals in the electrodeposited copper lms has been investigated. 26 These organic additives were adsorbed on the active sites on the surface of the electrode and combined with the metal ions to form complexes that changed the nucleation and growth of the crystals. [27][28][29] The microstructure and the morphology of the deposited metal change, and the X-ray diffraction pattern changes accordingly.…”
Section: Introductionmentioning
confidence: 99%
“…25 The inuence of the electrolyte additives on the shape and the morphology of nanocrystals in the electrodeposited copper lms has been investigated. 26 These organic additives were adsorbed on the active sites on the surface of the electrode and combined with the metal ions to form complexes that changed the nucleation and growth of the crystals. [27][28][29] The microstructure and the morphology of the deposited metal change, and the X-ray diffraction pattern changes accordingly.…”
Section: Introductionmentioning
confidence: 99%
“…This growth is consistent with the observations of Yunyu Joseph Han et al , who used organic additive malachite green (MG) in Cu ECD on Au substrate to form square pyramidal crystallites with Cu (200) direction. They thought the reason was the interactions of MG with Cu (111) surface were stronger than those with Cu (200) surface, and this stronger interaction partly blocked epitaxial growth on Cu (111) surface and prompted further growth on Cu (200) surface 7 .…”
Section: Resultsmentioning
confidence: 99%
“…Among these methods, ECD as a green approach has gained extensive attention in recent years, it’s widely accepted that ECD is one of the most extensively used ways due to the cost-effective, time saving and facile technique. During the process of ECD, there are lots of alterable parameters can affect the nucleation and growth process of crystals, such as potential, current, additive, temperature and pH 6 7 8 .…”
mentioning
confidence: 99%
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“…This can be achieved by laser ablation of copper surfaces, 13,41 plasma etching, 19 dealloying, 30,31 electrochemical polishing, 53 thermal annealing, 54 or electrodeposition. 10,18,20,22,43,55,56 Gowthaman and John demonstrated that the applied substrate potential during Cu electrodeposition affects the geometry of the obtained deposit. They obtained cubic, spherical, dendritic and prickly CuNSs from the same solution.…”
Section: Introductionmentioning
confidence: 99%