2013
DOI: 10.1016/j.nimb.2013.02.037
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Formation of thin DLC films on SiO2/Si substrate using FCVAD technique

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Cited by 3 publications
(4 citation statements)
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“…This evolution is mainly due to the higher acceleration strength of bombarding C ion, which is determined by the bias voltage during the FCVAD, leading to the subplantation of incident ions and local densification under the surface of the DLC films. 35,36 In addition, the effects of bias voltage applied to the substrates also are reflected in other aspects, including surface roughness and the thickness varying of the DLC films. Optical and atomic force microscopy images show that all of the DLC films deposited under different bias voltages are generally uniform and smooth, as shown in Figure 2d,e and Figure S3.…”
Section: ■ Results and Discussionmentioning
confidence: 99%
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“…This evolution is mainly due to the higher acceleration strength of bombarding C ion, which is determined by the bias voltage during the FCVAD, leading to the subplantation of incident ions and local densification under the surface of the DLC films. 35,36 In addition, the effects of bias voltage applied to the substrates also are reflected in other aspects, including surface roughness and the thickness varying of the DLC films. Optical and atomic force microscopy images show that all of the DLC films deposited under different bias voltages are generally uniform and smooth, as shown in Figure 2d,e and Figure S3.…”
Section: ■ Results and Discussionmentioning
confidence: 99%
“…In other words, the bonding structure of DLC would gradually evolve to a more and more diamond-like structure (less and less graphitic-like structure) as the substrate negative bias increases. This evolution is mainly due to the higher acceleration strength of bombarding C ion, which is determined by the bias voltage during the FCVAD, leading to the subplantation of incident ions and local densification under the surface of the DLC films. , …”
Section: Resultsmentioning
confidence: 99%
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