Structural, morphological, electrical and optical properties of Cu doped DLC thin films

Khan, M.I.; Adil, F; Majeed, Shahbaz; Farooq, W. A.; Hasan, M.S.; Jabeen, Raheela; Almutairi, Mona A.; Bukhtiar, Arfan; Iqbal, Munawar

doi:10.1088/2053-1591/ab58d5

Cited by 15 publications

(4 citation statements)

References 28 publications

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“…14 It indicates that Cu does not form compounds or solid solution into DLC films, but exists in the form of Cu nanoclusters. Similar result has been reported by Khan et al 15 3.2 Electrochemical behavior of Cu-DLC and (Cu:N)-DLC film electrode.-The [Fe(CN) 6 ] 3-/4redox system is very sensitive to the chemical state, microstructure, electron density and other factors on the electrode surface. Therefore it can well reflect the surface condition of carbon thin film electrode, which is often used to study the electron transfer characteristics and reaction kinetics of DLC, BDD and other electrode materials.…”

Section: Results and Disscusionsupporting

confidence: 83%

“…14 Copper (Cu) has good electrical conductivity and electrocatalytic activity. It can be shown that Cu dopant significantly improves the electrical conductivity of the DLC films by forming the conductive copper carbon chain, 15 and also appearing in clusters on the surface, which increases the specific surface area of the films. 16 Additionally, Zeng et al discovered 17 that the electrochemical activity and sensitivity of the electrode can improved by depositing Cu and Ag on the N doped DLC surface, Cu can not only improve the conductivity of DLC films, but also increase the electrochemical activity.…”

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confidence: 99%

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A Comparative Study of Copper-doped and Copper, Nitrogen Co-doped DLC Film Electrode and Its Electrochemical Properties

Wang¹,

Qiu²,

Lin³

et al. 2022

J. Electrochem. Soc.

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Copper (Cu), Nitrogen (N) Co-doped diamond-like carbon ((Cu:N)-DLC) films and Cu-doped DLC (Cu-DLC) films were fabricated by high-power impulse magnetron sputtering technique (HiPIMS). The influence of copper and nitrogen incorporation on the microstructure and electrochemical properties of Cu-DLC and (Cu:N)-DLC films were investigated by X-ray photoelectron spectroscopy, raman spectra, and electrochemical workstation. The surface of all of the films is cauliflower-like clusters, no obvious large particle Cu clusters can be observed. XRD patterns of theses films have only diffraction peak of copper and no other compounds. Raman spectra illustrate that Id/Ig varies from 2.79 to 3.01 as the N contents changes. XPS results identify that Cu does not form compounds or solid solution into DLC films. Electrochemical tests show that the electrode activity gradually increases with increasing the N contents of (Cu:N)-DLC electrode. Compared with (Cu:N)-DLC electrode, Cu-DLC electrode has a faster electron transfer rate (K0 is 1.88×10-2cms-1), low transfer resistance (227.0 Ωcm2), and a higher electrochemical activity (ΔEp is 93mV). Consequently, the electrochemical properties of Cu-doped DLC films are better than that of Cu, N co-doped DLC films.

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Section: Results and Disscusionsupporting

confidence: 83%

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confidence: 99%

A Comparative Study of Copper-doped and Copper, Nitrogen Co-doped DLC Film Electrode and Its Electrochemical Properties

Wang¹,

Qiu²,

Lin³

et al. 2022

J. Electrochem. Soc.

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“…Metal elements are often doped in coatings to improve their properties. For example, Some scholars have studied Ti, Cu, and Mo doped DLC coatings, and found that appropriate element doping can improve the mechanical and tribological properties of DLC coatings [19][20][21]. Al, Cr, and Zr were also doped into TiN coatings and achieved good expectations [22][23][24].…”

Section: Introductionmentioning

confidence: 99%

Current carrying tribological properties of multi arc ion plated titanium nitride doped silver coating

Hao,

Xia,

2024

Mater. Res. Express

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Sliding electrical contact materials play a crucial role in the transmission and conversion of electrical energy, but due to various factors such as force, electricity, and heat, the interface exhibits complex wear behavior. A single solid or liquid lubrication system can no longer meet the growing performance requirements of current carrying tribology. In this study, a TiN-Ag coating was prepared using multi arc ion plating technology, and a solid-liquid composite lubrication system was formed with ionic liquid and polyurea grease, respectively. Through current carrying friction and wear tests, their tribological properties, electrical contact resistance(ECR) values, and stability were tested, and compared with the results obtained during dry friction. The coating and worn surfaces were analyzed using scanning electron microscopy (SEM) and energy dispersive spectroscopy (EDS). The results indicated that compared with dry friction, TiN-Ag coatings lubricated with ionic liquids and polyurea grease showed higher friction reduction, wear resistance, and conductivity, especially the synergistic effect between ionic liquids and coatings is prominent. The behavior of ionic liquids under voltage was analyzed, and it was found that ionic liquids formed a physical adsorption film composed of a mixture of anions and cations on the worn surface. The ordered layered structure improved the tribological performance of the system.

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“…Cu is an essential microelement for the human body, and Cu ions promote adhesion and proliferation of endothelial cells. Recently, Cu doped Ag clusters, Diamond-like Carbon (DLC), TiN, and other ceramic materials have been reported [11][12][13]. Researchers have carried out experimental studies on the hardness [14][15][16], corrosion resistance [17], tribological properties [18,19], and biocompatibility [20][21][22][23] of Cu doped TiN films.…”

Section: Introductionmentioning

confidence: 99%

Evaluation of the Crystal Structure and Mechanical Properties of Cu Doped TiN Films

Fan

Xie

et al. 2022

Coatings

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In this study, TiN films doped with different copper contents (TiCuN) were prepared by using direct current magnetron sputtering method. The effects of Cu doping on composition, structure, and mechanical properties of TiN films were studied by energy-dispersive spectroscopy (EDS), X-ray diffraction (XRD), a Vickers microhardnessmeter, and density functional theory (DFT). The results of experimental and DFT study showed that Cu mainly replaced Ti atoms in TiN to form replacement solid solution doping. When Cu replaced Ti in TiN, a weak Cu-N (bond population varied from 0.06 to 0.11) covalent bond formed; meanwhile, the bonding strength of Ti-N (bond population varied from 0.29 to 0.4) bond adjacent to Cu increased. When Cu content was low, a small number of weak Cu-N bonds were formed, with strengthened Ti-N bond near Cu atom, resulting in an increased hardness of Cu doped TiN films. According to the theory of weak bonds, when the Cu content was increased further, the number of weak Cu-N bonds increased and TiCuN hardness decreased. With an increase in Cu content, it was found the toughness of TiCuN also increased. The results of this study will provide a theoretical and experimental guidance for improving the toughness and deformation resistance of TiN, which has a potential application in the surface modification of medical devices.

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Structural, morphological, electrical and optical properties of Cu doped DLC thin films

Cited by 15 publications

References 28 publications

A Comparative Study of Copper-doped and Copper, Nitrogen Co-doped DLC Film Electrode and Its Electrochemical Properties

A Comparative Study of Copper-doped and Copper, Nitrogen Co-doped DLC Film Electrode and Its Electrochemical Properties

Current carrying tribological properties of multi arc ion plated titanium nitride doped silver coating

Evaluation of the Crystal Structure and Mechanical Properties of Cu Doped TiN Films

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