Formation of composite nanostructures by corrosive deposition of copper into porous silicon

Mechanical strength of porous silicon and its possible applications

“…The rigid and uniform contact was realized by using the wet corrosion copper deposition [6]. This process allows to create a uniform layer of metal on the surface of porous silicon even on p+.…”

Silicon Porosification: State of the Art

“…The filling of macroporous silicon with Cu by electrodeposition has been investigated by the group of Föll, 568 by Fukami et al 569 and other groups. [570][571][572] Föll et al reported the successful complete filling of macropores exhibiting an aspect ratio of 75 (pore-diameter, 2 µm; pore-length, 150 µm). The porous silicon templates have been post-treated by sonication in CuSO 4 -solution and subsequently dipped in Piranha solution leading to a quite thick oxide layer of about 10 nm Electrodeposition of Au, Pt, and Pd into macropores has been shown by Fukami et al, 569 whereas Pd and Pt starts growing from the pore bottom but for the deposition of Au no condition could be found to achieve this behavior.…”

Thermal Properties of Porous Silicon

“…The filling of macroporous silicon with Cu by electrodeposition has been investigated by the group of Föll (Fang et al 2007a), Fukami et al (2008b, and other groups (Sasano et al 2000;Bandarenka et al 2008;Zacharatos and Nassiopoulou 2008). Föll and co-workers (Fang et al 2007a) reported the successful complete filling of macropores exhibiting an aspect ratio of 75 (pore-diameter 2 μm, pore-length 150 μm).…”