2012
DOI: 10.1103/physrevb.85.245306
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Formation and stability of a two-dimensional nickel silicide on Ni(111): An Auger, LEED, STM, and high-resolution photoemission study

Abstract: Using low energy electron diffraction (LEED), Auger electron spectroscopy (AES), scanning tunnelling microscopy (STM) and high resolution photo-electron spectroscopy (HR-PES) techniques we have studied the annealing effect of one silicon monolayer deposited at room temperature onto a Ni (111) substrate.The variations of the Si surface concentration, recorded by AES at 300°C and 400°C, show at the beginning a rapid Si decreasing followed by a slowing down up to a plateau equivalent to about 1/3 silicon monolaye… Show more

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Cited by 14 publications
(21 citation statements)
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References 37 publications
(40 reference statements)
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“…It should be noted that a higher temperature (650-850 K) was required for Si substitution of Ni atoms to form the surface alloy in the Si on Ni(111) system compared to that for the Si on Ag(111) system, which is consistent with the fact that Ni\ \Ni bond dissociation energy is higher than that for Ag\ \Ag [31]. For Si adsorption on Ni(111), electron transfer between the Si and Ni atoms has been reported at high temperatures [23], which indicates that the Si atoms strongly interact with the Ni atoms. Lalmi [23].…”
Section: Resultssupporting
confidence: 56%
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“…It should be noted that a higher temperature (650-850 K) was required for Si substitution of Ni atoms to form the surface alloy in the Si on Ni(111) system compared to that for the Si on Ag(111) system, which is consistent with the fact that Ni\ \Ni bond dissociation energy is higher than that for Ag\ \Ag [31]. For Si adsorption on Ni(111), electron transfer between the Si and Ni atoms has been reported at high temperatures [23], which indicates that the Si atoms strongly interact with the Ni atoms. Lalmi [23].…”
Section: Resultssupporting
confidence: 56%
“…ÞR30 phase [23], but did not do a detailed structural analysis. To the best of our knowledge, there are no available reports concerning Ge on Ni(111).…”
Section: Introductionmentioning
confidence: 89%
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“…The interfaces are usually formed by depositing Ni onto Si substrates, followed by a thermal treatment that leads to epitaxial Si-rich silicide overlayers. Ni-silicides may also be formed by Si deposition onto Ni substrates, and in this case Ni-rich silicides might be formed [4][5][6][7].…”
Section: Introductionmentioning
confidence: 99%