2007
DOI: 10.1088/0022-3727/40/3/028
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Focused ion beam (FIB) milling of electrically insulating specimens using simultaneous primary electron and ion beam irradiation

Abstract: There is currently great interest in combining focused ion beam (FIB) and scanning electron microscopy technologies for advanced studies of polymeric materials and biological microstructures, as well as for sophisticated nanoscale fabrication and prototyping. Irradiation of electrically insulating materials with a positive ion beam in high vacuum can lead to the accumulation of charge, causing deflection of the ion beam. The resultant image drift has significant consequences upon the accuracy and quality of FI… Show more

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Cited by 33 publications
(32 citation statements)
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“…For the electrical insulators charging compensation by electron beam during FIBID dramatically enhances the pattern defi nition [ 31 ]. FIBID-C has been tested on glass samples, as shown later in Sect.…”
Section: Patterning: Properties and Limitationsmentioning
confidence: 99%
“…For the electrical insulators charging compensation by electron beam during FIBID dramatically enhances the pattern defi nition [ 31 ]. FIBID-C has been tested on glass samples, as shown later in Sect.…”
Section: Patterning: Properties and Limitationsmentioning
confidence: 99%
“…Possible routes to minimize the damage caused by the ion beam include milling the polymers at cryogenic temperatures (e.g. −150°C) to reduce local heating (Niihara et al ., 2005; Sezen et al ., 2009; Kim et al ., 2011; Sezen et al ., 2011), applying an electrically conductive coating or using an electron flood gun against ion charging (Stokes et al ., 2007) or removing the polymer at a faster rate using water vapour (Kochumalayil et al ., 2009a, b).…”
Section: Introductionmentioning
confidence: 99%
“…To suppress such damaging effects of the ion beam on polymers, special preparation parameters has to be used. [13,14] Otherwise, FIB prepararion at low temperatures down to liquid nitrogen temperature (Cryo-FIB) is an option to reduce thermal input of the gallium ion beam and modification during FIB preparation.…”
Section: Introductionmentioning
confidence: 99%