Focused ion beam fabrication procedures of x-ray micro fresnel zone plates

Abstract

In this paper the use of focused ion beam (FIB) mask-less lithography is presented as a novel and simple way to fabricate x-ray Fresnel zone plates (FZPs), and a prototype of a FIB-made 100 nm resolution FZP with 38 zones is described. Considerations for future developments—the maximum aspect ratio achievable by FIB lithography in nickel, a way to produce zones with a parabolic transverse profile, as theoretically required for the highest efficiency in focusing—are also reported.

Focused-ion beam patterning of organolead trihalide perovskite for subwavelength grating nanophotonic applications

“…18 To obtain vertical sidewall patterning, using a low ion current is preferable to obtain finer ion beams, which can reduce material redeposition. 19,20 C. Incident angle Figure 11 presents an SEM image of rectangular trenches being milled to examine the effect of the ion incident angle on the sputtering yield. Upon increasing the incident angle The sputtering yield is plotted as a function of the incident angle in Fig.…”

Localised modifications of anatase TiO2 thin films by a Focused Ion Beam

“…Furthermore, as tailoring of functional properties of materials at the nanoscale is becoming a key issue in nanotechnology, the FIB's capability to easily produce ordered arrays of nanosized features in virtually every material has recently found a number of applications in sensing technology [16], molecular magnetic recording [17] and optics (e.g. X-ray optics [18], photonic crystals [19] and negative refractive index metamaterials [20]). …”

Zone plates for hard X-rays fabricated with the SPCVD technology

“…New types of X-ray optical elements such as multilayer X-ray mirrors, Fresnel zone plates (FZP), refractive and capillary X-ray lenses were created [1]. They were proved to be complimentary to the grazing incidence mirrors and crystals, which had been in use for a long time.…”

“…Fabrication of efficient zone plates, which currently is mainly done by electron-beam lithography, is a complicated and expensive process [1,8,9]. Nevertheless utilization of the lithography allowed fabrication of FZP with the outer zone's width as low as 20 nm, which have a comparable spatial resolution (see above).…”

“…Since the existing lithography processes are limited to aspect ratios on the order of 10-20, a hard X-ray FZP may have diffraction efficiency much smaller than the theoretical limit. In addition, the large aspect ratios and the intrinsic slowness of the e-beam lithography make FZP expensive [1,9].…”