Lithography 2013
DOI: 10.1002/9781118557662.ch4
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Focused Ion Beam Direct‐Writing

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Cited by 6 publications
(11 citation statements)
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“…Traditional photolithographic fabrication methods have started to reach fundamental limits in the size of features they can produce 1–3 and the next generation methods such as extreme ultraviolet lithography 4,5 have many lingering issues needing to be addressed to become economically viable 6,7 . Thus, alternative lithographic methods such as block copolymer (BCP) directed self-assembly (DSA) 813 , direct write focused ion or electron beam 14,15 , or other multistep patterning photolithography techniques 1618 are necessary to continue the trend predicted by Gordon Moore of device density doubling every couple of years 19 . In particular, BCP DSA can be quite prone to defects 20 and poor long-range order 21,22 compared to traditional lithography, and as a result better metrology techniques for measuring the overall order need to be implemented.…”
Section: Introductionmentioning
confidence: 99%
“…Traditional photolithographic fabrication methods have started to reach fundamental limits in the size of features they can produce 1–3 and the next generation methods such as extreme ultraviolet lithography 4,5 have many lingering issues needing to be addressed to become economically viable 6,7 . Thus, alternative lithographic methods such as block copolymer (BCP) directed self-assembly (DSA) 813 , direct write focused ion or electron beam 14,15 , or other multistep patterning photolithography techniques 1618 are necessary to continue the trend predicted by Gordon Moore of device density doubling every couple of years 19 . In particular, BCP DSA can be quite prone to defects 20 and poor long-range order 21,22 compared to traditional lithography, and as a result better metrology techniques for measuring the overall order need to be implemented.…”
Section: Introductionmentioning
confidence: 99%
“…As the binding energy of the atoms in the CsPbBr3 target sample (several eV) [20] is much smaller than the kinetic energy of Ga + ion at 30 keV, the atoms in CsPbBr3 will be readily displaced from their lattice positions by the elastic core collision resulting from energy and momentum exchanges when the Ga + ion beam is directed onto the target sample. [14,21] Moreover, the incident ions after collision and the target atoms knocked free from the lattice sites may still have enough energy to displace more target atoms, which in turn continue to dislocate yet other atoms. [14,22] As a result, a "displacement cascade" is formed upon Ga + ion irradiation, which generates plenty of defects including vacancies and interstitials, leading to the PL quenching phenomenon.…”
mentioning
confidence: 99%
“…На рис. 2 на врезке приведены профили изоповерхностей плотности энергии, в которых поглощается определенная доля (от 20 до 90%) всей энергии и показаны размеры зоны (8), (9). Можно отметить, что эти размеры близки к размеру профиля с 50% энергии.…”
Section: аналитическое описание распределения поглощенной энергииunclassified
“…Для этих методов характерна низкая энергетическая эффективность. При ионном распылении на разрыв связей атома с подложкой тратится 1−5 eV [7] из нескольких keV энергии иона, что означает энергетическую эффективность ∼ 10 −4 , даже для очень высоких значений коэффициента распыления ∼ 2−3 [8,9]. При использовании ионного пучка для осаждения жидких или газообразных соединений с их последующим разложением эффективность не многим выше, поскольку число распавшихся молекул прекурсора на один ион составляет от 2 до 10 [10][11][12][13].…”
Section: Introductionunclassified