Fluorinated Organic−Inorganic Hybrid Mold as a New Stamp for Nanoimprint and Soft Lithography

Choi, Dae‐Geun; Jeong, Jun‐Ho; Sim, Young-suk; Lee, Eung-Sug; Kim, Woo-Soo; Bae, Byeong‐Soo

doi:10.1021/la0513205

Cited by 67 publications

(50 citation statements)

References 25 publications

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“…In this work, a new material system for fabricating the resonant optical filters is employed. Hybrimers are typical organic-inorganic hybrid materials fabricated using a sol-gel process (Choi et al, 2005) . Hybrimers have several advantageous properties, including high modulus, low surface tension, low shrinkage, and high etching resistance.…”

Section: Introductionmentioning

confidence: 99%

Guided-Mode Resonance Filters Fabricated with Soft Lithography

Lee¹,

Jin²,

Bae³

et al. 2011

Recent Advances in Nanofabrication Techniques and Applications

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Section: Introductionmentioning

confidence: 99%

Guided-Mode Resonance Filters Fabricated with Soft Lithography

Lee¹,

Jin²,

Bae³

et al. 2011

Recent Advances in Nanofabrication Techniques and Applications

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“…[8][9][10][11][12][13] The bases for these molds are typically urethanes, [14,15] epoxies, and perfluoro polymers. [13,16,17] They are optically transparent and easily replicable upon UV polymerization. However, urethanes and epoxies possess high surface energies, requiring antiadhesion treatment of the surface for easy release of the mold.…”

mentioning

confidence: 99%

“…However, urethanes and epoxies possess high surface energies, requiring antiadhesion treatment of the surface for easy release of the mold. To overcome this problem, a new mold that contains a perfluoroether polymer [13,16,17] as a basic component was developed to reduce the surface energy. The perfluoro group in the composite mold reduces the total surface energy to 8 mN m -1 , which is lower than that of the intrinsic PDMS mold (21 mN m -1…”

mentioning

confidence: 99%

Antiadhesion Surface Treatments of Molds for High‐Resolution Unconventional Lithography

Lee

Lim

et al. 2006

Advanced Materials

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A new strategy is needed for the mass production of microand nanostructures on a wide variety of substrates, which can be applied in various fields of manufacturing, for example, microelectronics, micro-optics, photonics, and chemical or biosensors. Since the early 1990s, simple unconventional lithographic techniques, such as soft lithography, [1][2][3] imprint lithography, [4,5] and others, [6][7][8][9][10][11] have been developed for the economical and rapid fabrication of micro-and nanostructures applicable to various fields of electronics and optics. However, as the feature size diminishes rapidly, a grand challenge that remains to be overcome is the fabrication of dense and complex nanostructures with high aspect ratios, and, in this process, accomplishing the complete release of the mold from the patterned substrate becomes essential. For this reason, many research efforts are directed towards lowering the adhesion between the mold and the patterned polymer on a substrate.Here, we introduce a new strategy to achieve an antiadhesion surface for the simple, rapid fabrication and replication of nanostructures with high fidelity that is applicable to all types of stamping molds. In this study, the surface of various hard and soft molds was bound strongly and covalently with low-viscosity poly(dimethylsiloxane) (PDMS), which has good surface properties for the molding process, i.e., low surface energy and low adhesion properties, like normal PDMS molds. The surface modification was accomplished irrespective of the basic materials comprising the mold. In particular, to show the antiadhesion effect of the coated PDMS layer, molds with nanoscale features were replicated from SiO 2 nanostructures using general UV-curable polymers, such as optical adhesives and photoresists originally designed to have good adhesion with SiO 2 . With this method, we replicated complex nanostructures with high aspect ratios, for example, 80 nm line patterns at least 400 nm in height and 150 nm line patterns that were 1.4 lm in height, on various substrates such as glass, Si/SiO 2 wafers, and flexible polymer sheets with areas exceeding several tens of square centimeters.In general, soft lithography has adopted PDMS as the mold material because of its high elasticity, easy replicability, and intrinsically low adhesion properties. However, because of the innate softness of PDMS [1] it is not suitable for molding nanoscale features, and numerous molds with high mechanical strength have been introduced as an alternative to improve the fidelity in nanostructure molding. [8][9][10][11][12][13] The bases for these molds are typically urethanes, [14,15] epoxies, and perfluoro polymers. [13,16,17] They are optically transparent and easily replicable upon UV polymerization. However, urethanes and epoxies possess high surface energies, requiring antiadhesion treatment of the surface for easy release of the mold. To overcome this problem, a new mold that contains a perfluoroether polymer [13,16,17] as a basic component was developed to reduce the ...

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“…Processing cycle time: fast heating systems with negligible resist cooling times by application of heat to the stamp [143] or of a single laser pulse, [144] room temperature systems, [145,146,147] and pressure control, [148,*] demolding implications [149] and incorporation of step-and-repeat systems presence of residual layer [150a] multilevel processing (alignment) [151] contamination control: intermediate polymer stamps (IPS) [152] real-time monitoring systems [153] and feature analysis [150b] Resist visco-elastic properties [154] etch resistance and selectivity thermal stability during thermal imprinting and mechanical stability during demolding [155,156] Mold hardness, durability and surface energy control: anti-adhesive coatings [157,158] and novel anti-adhesive mold materials [147,159,160] mold design rules for optimal filling [161] implications by difference in thermal expansion coefficient between substrate/mold [162] Transfer pattern transfer fidelity of plasma etching [163] * Several efficient strategies to reduce the imprint pressure in nanoimprint lithography are part of soft lithography (see Section 2.3.2).…”

Section: Molding/ Demoldingmentioning

confidence: 99%

“…Solutions to reduce this adhesion and increase the mold durability are (1) incorporation of internal release agents in resist formulations, (2) application of low-surface energy coatings (in thin film [157] or monolayer [158] of surfactants) to the mold, and (3) fabrication of a mold from materials with intrinsic low surface energy. [147,159,160] The ideal resist formulations for NIL have several characteristic properties for successful pattern transfer, including good deformability at the imprint conditions Siloxane block or graft copolymers [168] also form a potential class of (in this case) Real-time imprint monitoring systems (RIMS) [153] are under development that allow ultimate control over the imprinting process (temperature, pressure, time). The condition for short processing times in IC manufacturing has driven current research activities in thermal NIL to step-and-repeat patterning schemes that have a strong similarity with the stepper system in conventional photolithography.…”

Section: Molding/ Demoldingmentioning

confidence: 99%

Patterning strategies in nanofabrication : from periodic patterns to functional nanostructures

Bruinink¹

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Chapter 2 -Unconventional strategies in nanofabrication:patterning principles The drive towards the miniaturization of electronic circuits comes at the penalty of higher resistances and higher levels of power dissipation. The advantages of using light instead of electrons as the information carrier account for the efforts that are undertaken to progress the high-density integration and system performance towards all-optical circuits by the incorporation of photonic crystal (PhC) structures. [7] PhC structures represent a novel class of optical materials (also present in nature [8] ) that contain periodic modulations in dielectric contrast resulting from two- [9] and/or threedimensional [10] structuring of matter at the scale of the optical wavelength. The resulting characteristic photonic band gap (PBG) for a specific range of frequencies [11] is responsible for the corresponding strong confinement and localization of light, [12] and Chapter 6 describes the entire engineering technology to set the design rules for optimal LOCOS inversion in terms of layer thickness and etch selectivities. The partial conversion of silicon nitride (Si 3 N 4 ) to silicon oxynitride (SiN x O y ) during the oxidation step of the LOCOS procedure is shown by etch rate measurements. The use of guidelines is shown to systematically locate the optimal parameters for silicon etching at high anisotropy and high etch selectivity using ultrathin SiO 2 etch masks.Chapter 7 presents the successful fabrication and replication of 2D PhCWGs on silicon-on-insulator (SOI) substrates by elaborating on the technological advancements in NIL processing set in Chapter 6. Local examination using photon scanning tunneling microscopy (PSTM) has been carried out to assess the guiding properties of the resulting 2D PhCWGs (in terms of confinement and loss of the propagating light) at wavelengths in the telecommunication range. References Introduction1965 is the year that the co-founder of Intel ® Gordon Moore came with his prediction, now known as Moore's Law, that the number of transistors on a chip doubles every two years. architecture. With about twice the density of the preceding 65 nm technology, this technology packs about double the number of transistors into the same silicon space (to about one billion for a quad-core processor).[2]The International Technology Roadmap for Semiconductors (ITRS) [3] is an assessment of the Semiconductor Industry Association (SIA) [4] to chart the necessary advancements in technology by identifying the technological challenges for the continuation of Moore's Law (Fig. 2.2). [3]8Unconventional strategies in nanofabrication:patterning principlesThe main challenge is to meet the stringent industrial requirements of cost-effective manufacturing with excellent critical dimension (CD) control in combination with accurate control of positioning (overlay) at ever-increasing resolution. [5] As shown in The inherent limitations of photolithography (in general) with respect to resolution (R) and depth-of-focus (D...

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Fluorinated Organic−Inorganic Hybrid Mold as a New Stamp for Nanoimprint and Soft Lithography

Cited by 67 publications

References 25 publications

Guided-Mode Resonance Filters Fabricated with Soft Lithography

Guided-Mode Resonance Filters Fabricated with Soft Lithography

Antiadhesion Surface Treatments of Molds for High‐Resolution Unconventional Lithography

Patterning strategies in nanofabrication : from periodic patterns to functional nanostructures

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