Fluid/Structure Interaction Investigation in PBGA Packaging

Ramdan, Dadan; Abdullah, M. Z.; Khor, C. Y.; Leong, Wei Chiat; Loh, Wei Keat; Ooi, C. K.; Ooi, Renn Chan

doi:10.1109/tcpmt.2012.2215860

Cited by 31 publications

(10 citation statements)

References 21 publications

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“…Therefore, the fundamental understanding of the FSI during molded packaging is important for the engineers and package designers. The fluid/structure interaction (FSI) phenomenon was also extensively reported in the encapsulation [1] [2].…”

Section: Introductionmentioning

confidence: 89%

A novel method to predict fluid/structure interaction in IC packaging

Hsu

Wang²,

Chen³

et al. 2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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This paper reports a perspective investigation of computational modeling of fluid-structure interaction (FSI) in molded integrated-circuit(IC) packaging. The investigation is carried out through two aspects, respectively on interaction between the fluid and structure in the encapsulation process and appropriate methodology for modeling. We present a novel and integrated method to predict the FSI during the encapsulation process. This method not only provides more accurate melt front and pressure result but also predict precisely the FSI behavior through the dynamic mesh deformation technique simultaneously in accordance with continually deformed geometry (two way FSI). This is different from previous study that only one way considered fixed geometry (one way FSI) during encapsulation. Moreover, the experimental data for single-and stacked-chip were compared with the simulation results for two way FSI implementation to verify flow front advancement. From a real paddle shift case study, the result indicates that the deflection prediction is well predicted and could predict void formation well when it considers two way FSI effect. It is expected that this paper could clarify relevant issues in prediction of FSI in IC packaging and induce more considerations for modeling FSI using two way FSI multiphase flow method.

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Section: Introductionmentioning

confidence: 89%

A novel method to predict fluid/structure interaction in IC packaging

Hsu

Wang²,

Chen³

et al. 2014

2014 IEEE 64th Electronic Components and Technology Conference (ECTC)

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show abstract

“…In the simulation, the encapsulant material was assumed as generalized Newtonian fluid (GNF). The Castro-Macosko model [6,9] was applied to predict the relationship between the viscosity and degree of polymerization and describe the viscosity of the encapsulant material as follows:…”

Section: Viscosity Modelsmentioning

confidence: 99%

“…Kamal's equation [6,9] described the curing effect and integrated with the Castro-Macosko model in the current study. The rate of the chemical conversion of the compound in this model can be predicted as follows: ,…”

Section: Viscosity Modelsmentioning

confidence: 99%

Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process

et al. 2017

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Abstract. This paper presents the investigation of the effects of epoxy moulding compound' (EMC) viscosity on the FSI aspects during moulded underfill process (MUF). Finite volume (FV) code and finite element (FE) code were connected online through the Mesh-based Parallel Code Coupling Interface (MpCCI) method for fluid and structural analysis. The EMC flow behaviour was modelled by Castro-Macosko model, which was written in C language and incorporated into the FV analysis. Real-time predictions on the flow front, chip deformation and stress concentration were solved by FV-and FE-solver. Increase in EMC viscosity raises the deformation and stress imposed on IC and solder bump, which may induce unintended features on the IC structure. The current simulation is expected to provide the better understandings and clear visualization of FSI in the moulded underfill process.

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“…The volume of fluid (VOF) tracks the flow front during the wave soldering process. The governing equation of melt front over time is governed by the following transport equation (Ramdan et al 2012):…”

Section: Governing Equationsmentioning

confidence: 99%

Effects of PCB thickness on adjustable fountain wave soldering

Aziz

Abdullah

Khor

et al. 2015

Sadhana

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This study investigates the effects of printed circuit board (PCB) thickness on adjustable fountain and conventional wave soldering. The pin-through-hole (PTH) vertical fill is examined with three PCBs of different thicknesses (i.e., 1.6, 3.1, and 6.0 mm) soldered through adjustable fountain and conventional wave soldering at conveyor angles of 0 • and 6 •. The vertical fill of each PCB is the focus. The PTH solder profile is inspected with a non-destructive X-ray computed tomography scanning machine. The percentages of the PTH vertical fill of both soldering processes are also estimated and compared. The aspect ratio of the PCB is also investigated. Experimental results reveal that adjustable fountain wave soldering yields better vertical fill than conventional wave soldering. The vertical fill level of adjustable fountain wave soldering is 100%, 90%, and 50% for the 1.6, 3.1, and 6.0 mm PCB thickness, respectively. FLUENT simulation is conducted for the vertical fill of the solder profile. Simulation and experimental results show that the PTH solder profiles of the two soldering processes are almost identical. The effect of PCB thickness on PTH voiding is also discussed.

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Fluid/Structure Interaction Investigation in PBGA Packaging

Cited by 31 publications

References 21 publications

A novel method to predict fluid/structure interaction in IC packaging

A novel method to predict fluid/structure interaction in IC packaging

Influence of Material Properties on the Fluid-Structure Interaction aspects during Molded Underfill Process

Effects of PCB thickness on adjustable fountain wave soldering

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