Fluid Flow and Thermal Characteristics of a Minichannel Heat Sink with Impinging Air Flow

Beriache, M’hamed; Bettahar, A.; Naji, Hassane; Loukarfi, L.; Saidia, L. Mokhtar

doi:10.1007/s13369-012-0321-3

Cited by 9 publications

(7 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The axial fan is placed above the heat sink at a height of 40 mm, 33,34 providing an impinging air‐cooling jet operates from a DC voltage, with maximum electrical power consumption of 8.4 W (12 V 0.7 A). The velocities of the air jet vary with the fan's electrical power supply.…”

Section: Experimental Methodology and Measurement Proceduresmentioning

confidence: 99%

“…Furthermore, the maximum heat dissipation power of new generation of CPU Intel-Core-i7 is around 95 W under a highly complex workload defined by Intel, and the maximum temperature allowed on the processor's integrated heat distributor is 72.2°C. 32 On this basis, three electrical powers for the heat source are adopted in this experimental study, to know: 60, 87, and 95 W. The axial fan is placed above the heat sink at a height of 40 mm, 33,34 providing an impinging air-cooling jet operates from a DC voltage, with maximum electrical power consumption of 8.4 W (12 V 0.7 A). The velocities of the air jet vary with the fan's electrical power supply.…”

Section: Experimental Methodology and Measurement Proceduresmentioning

confidence: 99%

See 1 more Smart Citation

Experimental investigation on controlled cooling by coupling of thermoelectric and an air impinging jet for CPU

et al. 2020

View full text Add to dashboard Cite

In this study, experimental tests have been carried out on the coupling thermoelectric cooling module with minichannel heatsink subjected to impinging airflow for cooling desktop central processing unit (CPU). A controlled thermoelectric‐forced test system was designed for this purpose. This was designed using electronic Arduino card. The proposed hybrid cooling system was compared with the conventional forced air‐cooling technique. Three power of heat source (CPU) were adopted, investigated, and compared, namely 60, 87, and 95 W. Performance of controlled thermoelectric cooling with three preset temperature were experimentally examined. The effects of air velocity and thermoelectric input current on the case temperature (Tcase), thermal resistance, and heat transfer coefficient were analyzed. Results showed that the Tcase increases with the increase of its input power. In addition, increasing air jet velocity and thermoelectric input current improve CPU cooling significantly. For a CPU power of 95 W, the recorded Tcase temperature was 57°C with the conventional system. While it was maintained below 50°C in the hybrid system. The thermoelectric cooler has had a major effect on CPU cooling, having 15% improvement over conventional forced air‐cooling. However, this was accompanied by an increase in energy consumption in the range of 45 W.

show abstract

Section: Experimental Methodology and Measurement Proceduresmentioning

confidence: 99%

Section: Experimental Methodology and Measurement Proceduresmentioning

confidence: 99%

Experimental investigation on controlled cooling by coupling of thermoelectric and an air impinging jet for CPU

et al. 2020

View full text Add to dashboard Cite

show abstract

“…The velocity of the jet in the considered cooling system is low in the central zone of the duct. This is due to the passive area of the axial fan motor, thus causing a low cooling zone [25]. This zone of low air jet corresponds to the hottest zone on the heat sink [26].…”

Section: Influence Of the Height Of The Impinging Jet On The Velocitymentioning

confidence: 99%

Experimental study of aero-thermal heat sink performances subjected to impinging air flow

Belarbi¹,

Beriache²,

Bettahar³

2018

IJHT

View full text Add to dashboard Cite

In this study, experimental investigation of thermal and aerodynamic performances of a rectangular mini-channel heat sink subjected to an impinging air jet was carried out with the aim to improve the cooling performance of personal computer CPUs. The influence of the impinging distance on the velocity profile, the pressure drop, the case temperature, the thermal resistance, and the heat transfer coefficient are studied. Moreover, the effect of the positioning of the microprocessor (heat source) on the thermal performance was investigated. The results show a ratio "height jet/diameter" Y/D=0.606 offer a better cooling, and a longitudinal displacement of the heat source (central processor unit) 10 mm from the original position (center) improve the cooling performance. The enhancement rate was in a range of 10% compared to the initial position (central position before shifting the source).

show abstract

“…The performance of these systems is directly related to the temperature; therefore, it is a crucial issue to maintain the components at acceptable temperature levels. Microchannel heat exchangers have been proven to have relatively higher heat dissipation capabilities than conventional heat removal devices because of their higher heat transfer surface area to fluid volume ratio and have been widely used for electronics cooling in order to maintain the temperatures at an acceptable level. For example, to avoid permanent damage to a laptop CPU, its temperature should not exceed 80 °C to 90 °C .…”

Section: Introductionmentioning

confidence: 99%

Experimental Investigation of Heat Transfer Characteristics and Cooling Performance of Mini‐ and Microheat Exchangers

Marzougui

Nmiri

Hammami

et al. 2016

Heat Trans. Asian Res.

View full text Add to dashboard Cite

This paper presents an experimental investigation of forced convection heat transfer in two heat sinks for electronic system cooling and investigated the comparisons of the thermal behavior of the mini-and microchannel heat exchangers. The hydraulic dimension of one of the heat sinks is 2 mm while that of the other is 180 m. Deionized water was used as the working fluid for studies conducted in both the heat exchangers. The effect of heat flux and volumetric flow rate (in laminar flow regime) on temperature and heat transfer coefficient is studied. Irrespective of the average heat transfer coefficient and the total thermal resistance, advantages and limitations of each device are analyzed and discussed in the light of experimental results. Furthermore, the results obtained from the experiments were in good agreement with those obtained from the design theory analyses.

show abstract

Fluid Flow and Thermal Characteristics of a Minichannel Heat Sink with Impinging Air Flow

Cited by 9 publications

References 8 publications

Experimental investigation on controlled cooling by coupling of thermoelectric and an air impinging jet for CPU

Experimental investigation on controlled cooling by coupling of thermoelectric and an air impinging jet for CPU

Experimental study of aero-thermal heat sink performances subjected to impinging air flow

Experimental Investigation of Heat Transfer Characteristics and Cooling Performance of Mini‐ and Microheat Exchangers

Contact Info

Product

Resources

About