Experimental investigation on controlled cooling by coupling of thermoelectric and an air impinging jet for CPU

Abstract

In this study, experimental tests have been carried out on the coupling thermoelectric cooling module with minichannel heatsink subjected to impinging airflow for cooling desktop central processing unit (CPU). A controlled thermoelectric‐forced test system was designed for this purpose. This was designed using electronic Arduino card. The proposed hybrid cooling system was compared with the conventional forced air‐cooling technique. Three power of heat source (CPU) were adopted, investigated, and compared, namely 60, 87, and 95 W. Performance of controlled thermoelectric cooling with three preset temperature were experimentally examined. The effects of air velocity and thermoelectric input current on the case temperature (Tcase), thermal resistance, and heat transfer coefficient were analyzed. Results showed that the Tcase increases with the increase of its input power. In addition, increasing air jet velocity and thermoelectric input current improve CPU cooling significantly. For a CPU power of 95 W, the recorded Tcase temperature was 57°C with the conventional system. While it was maintained below 50°C in the hybrid system. The thermoelectric cooler has had a major effect on CPU cooling, having 15% improvement over conventional forced air‐cooling. However, this was accompanied by an increase in energy consumption in the range of 45 W.

A novel thermoelectric CPU cooling system controlled by artificial intelligence

“…Termoelektrik soğutucular, elektronik yongaların soğutulmasında, çalışma kimyasalları içermemeleri , uygulama yönteminin kolay ve ekonomik olması nedeniyle tercih edilmektedir [14]. Bir termoelektrik modüle verilen elektrik akımı ve üzerinden geçen havanın hızı arttıkça soğutma performansı artmaktadır [15]. Genel olarak, bu sonuçlar bir kontrol metodolojisinin hem araştırma hem de endüstriyel uygulamalarda faydalı olabileceğini göstermektedir [16] Tasarım ve uygulamayı kolaylaştırmak için algoritmalardan oluşan derin öğrenme modelleriyle daha iyi tahminler yapılabilmektedir [17].…”

Effect of liquid saturated porous medium on heat transfer from thermoelectric generator

“…TEG efficiency is influenced by different factors, including: (i) thermoelectric properties of the material in terms of thermal conductivity K, Seebeck coefficient α, and resistivity ρ, (ii) temperature gradient, which is affected by the sink and source capacities and heat transfer rate, (iii) the figure of merit (ZT) which is a non-dimensional metric that represents TEG overall performance [11,12].…”

Sustainable Self-Cooling Framework for Cooling Computer Chip Hotspots Using Thermoelectric Modules

“…Their test results showed that this system improved the cooling performance by 64.8% in relation to the traditional air-cooling. Lin et al [62] combined a TE module with a microchannel heat sink filled with TiO2 nanofluid that was successful in cooling an LED substrate below 53.1 • C when it was subjected to an ambient temperature of 65 • C. Belarbi et al [63] reported that combining air-jet impingement cooling with TE cooling improved the CPU cooling performance by 15%. Based on a thin-film TE module, Kattan et al [64] suggested a form of on-demand cooling solution for the mobile chip.…”