Experimental Investigation of Heat Transfer Characteristics and Cooling Performance of Mini‐ and Microheat Exchangers

Abstract

This paper presents an experimental investigation of forced convection heat transfer in two heat sinks for electronic system cooling and investigated the comparisons of the thermal behavior of the mini-and microchannel heat exchangers. The hydraulic dimension of one of the heat sinks is 2 mm while that of the other is 180 m. Deionized water was used as the working fluid for studies conducted in both the heat exchangers. The effect of heat flux and volumetric flow rate (in laminar flow regime) on temperature and heat transfer coefficient is studied. Irrespective of the average heat transfer coefficient and the total thermal resistance, advantages and limitations of each device are analyzed and discussed in the light of experimental results. Furthermore, the results obtained from the experiments were in good agreement with those obtained from the design theory analyses.

Composite pin‐fin heat sink for effective hotspot reduction

“…Since there is an increase in the TDP of processors, it is impossible to cool the processors using traditional cooling methods like forced air cooling. 7 Various alternative methods like heat pipe, 8 vapor chamber, 9 PCM, [10][11][12] thermoelectric cooling, 13,14 liquid cooling, 7 microchannel, [15][16][17] and so on, are used to keep the processors in a safe temperature range. A heat sink is a heat exchanger which removes the heat from any mechanical or electronic component and vents out to a fluid medium, usually liquid coolant or air.…”