1997
DOI: 10.1109/5.622505
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Flash memory cells-an overview

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Cited by 623 publications
(331 citation statements)
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References 75 publications
(98 reference statements)
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“…Advanced flash memory technology can store more than 1 bit in each flash memory cell, making it possible to increase the memory density further without reducing the cell size. The stored charges are located in the potential well of blocking (or sometimes called control oxide) and tunnelling oxide layers, so the information can be maintained even after the power outage, resulting in nonvolatile memory operations [19][20][21]. This is the major technical advancement that has been made since the invention of flash memory devices using the floating gate.…”
Section: Operations Of Non-volatile Memory Devicesmentioning
confidence: 99%
See 1 more Smart Citation
“…Advanced flash memory technology can store more than 1 bit in each flash memory cell, making it possible to increase the memory density further without reducing the cell size. The stored charges are located in the potential well of blocking (or sometimes called control oxide) and tunnelling oxide layers, so the information can be maintained even after the power outage, resulting in nonvolatile memory operations [19][20][21]. This is the major technical advancement that has been made since the invention of flash memory devices using the floating gate.…”
Section: Operations Of Non-volatile Memory Devicesmentioning
confidence: 99%
“…Therefore, tremendous effort has been made toward the development of high-density, low-cost, and nonvolatile solid-state storage devices [17][18][19][20][21][22][23][24][25][26][27][28]. Among the many types of non-volatile memory technology, flash memory devices based on the floating gate have been widely used due to their massive memory capacity, which has been required for many applications [17,[19][20][21]23]. However, floating-gate based flash memory has been reported to have limits in continuous device scaling due to increasing cell-to-cell interference, decreasing coupling ratio, non-scalable tunnelling oxide thickness, decreasing tolerance for charge loss, etc.…”
Section: Introductionmentioning
confidence: 99%
“…Whenever a charge Q is stored in the floating gate, simple electrostatics [32] shows that the threshold voltage V T of the cell becomes…”
Section: Array Architecture and Layoutmentioning
confidence: 99%
“…There are a large number of variations on flash memory devices and programming modes. 36 Among the mechanisms used for writing into storage layers, Hot Electron Injection (HEI) is widely used to speed up write times. In the presented devices, the HEI are insignificant as the size of the device is much greater than the thermalization length of carriers.…”
Section: This Is Indeed the Case As Shown In Figures 2(c) And 2(d)mentioning
confidence: 99%