Fixed abrasive machining of non-metallic materials

Shih, Albert J.; Denkena, Berend; Grove, Thilo; Curry, David; Hocheng, H.; Tsai, Hsiang‐Lin; Ohmori, Hitoshi; Katahira, Kazutoshi; Pei, Zhijian

doi:10.1016/j.cirp.2018.05.010

Cited by 33 publications

(16 citation statements)

References 87 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The spinel phases were extremely brittle and were easily ejected from the matrix with a reduction in Bi 2 O 3 IP towards the edges. Comparing the central segments of the ceramic in the SE topographical imaging, the 0.1 mm/rev showed a lack of surface deterioration, which progressed further as the feed velocity increased up to 0.2 mm/rev, resulting in more pronounced chipping rather than grain pull-out due to the effect of the tangential shear cutting forces [1,3,4]. This roughness of the ceramic edges is yet more protuberant in the phase contrasting images in Figure 11d-f in linear relation with the feed velocities.…”

Section: Electron Microscopy Characterization Of the Machined Surfacesmentioning

confidence: 99%

“…Lapping is considered as a contemporary industrial practice in the machining of brittle ZnO ceramics. The conventional machining approach for hard ZnO ceramics is non-productive as the grinding and lapping technologies represent limited productivity due to frequent uncontrolled chipping or a sharpening of the finished products' edges at the expense of high machining costs and tool blunting [3,4]. Moreover, the material removal rate is quite low which makes conventional machining significantly difficult with poor sustainability [1].…”

Section: Introductionmentioning

confidence: 99%

See 1 more Smart Citation

Evaluation of Chip Formation Mechanisms in the Turning of Sintered ZnO Electro-Ceramics

2021

View full text Add to dashboard Cite

The sintered zinc oxide (ZnO) electro-ceramics are a brittle class of hard-to-cut materials such that shaping them with the post-finishing operations necessitates careful handling and precision machining. The conventional machining approach using the grinding and lapping processes represents limited productivity, an inability to produce the required geometries and frequent uncontrolled chipping of the edges of the final products. This study thus investigates the turning performance of dense sintered ZnO varistors and chip formations to obtain the parametric range (cutting mechanism) which causes the chipping or the trans-granular/sudden failure in these brittle materials. With the analysis of the cutting tool vibration in relation to the machining parameters (f and VC), the vibration-induced chipping correlations are made and interlinked with the occurrence of grain pull-out during the turning operation. The results show that the reflected vibratory motion of the tools is directly correlated with the chip formation mechanisms in the turning of ZnO ceramics and thus provide robust measurements for quality assurance in final products.

show abstract

Section: Electron Microscopy Characterization Of the Machined Surfacesmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Evaluation of Chip Formation Mechanisms in the Turning of Sintered ZnO Electro-Ceramics

2021

View full text Add to dashboard Cite

show abstract

“…The diamond grain performs the work-material removal while the bond provides the right level of grains retention forces and wear resistance for optimal tool performance, which is characterized by the appropriate balance between the wear of the diamond grains and the timely wear of the bonding agent. This phenomenon is known as the self-sharpening effect [24]. The wear resistance of the grains and the bond is mostly determined by the respective material properties [25], [26], while the abrasive grains retention force can be adjusted by the fabrication process of the tool, and the machining performance of which can be therefore influenced.…”

Section: Abrasive Grains Retentionmentioning

confidence: 99%

An Experimental Study on the Abrasive Machining Process of Electronic Substrate Material With A Novel Ultraviolet-Curable Resin Bond Diamond Lapping Plate

et al. 2019

View full text Add to dashboard Cite

Sapphire is one of the most widely used electronic substrate materials in the industry. The manufacturing process of sapphire and such hard and brittle materials is extremely time and energy consuming because of their superior material properties in physical and chemical behaviors. In this study, the ultraviolet-curable resin is introduced into the fabrication of the diamond abrasive lapping plate as a bonding agent. A practical manufacturing process is established in the laboratory to develop an ultraviolet-curable resin bond fixed abrasive lapping plate for the precision machining of sapphire substrates, the machining performance of which is examined through a series of comparative experiments among the conventional fixed-abrasive lapping, the slurry-based lapping and this originally developed plate involved lapping. The surface topography and surface roughness of the machined sapphire workpieces are measured to evaluate the surface quality, and the weight loss of the workpieces in each machining process is recorded to estimate the respective machining efficiency. The promising results achieved from the ultraviolet-curable resin plate lapping process, in terms of a relatively higher material removal rate and better surface quality, indicate that the occurrence of a corporate action integrating both the advantages of the fixed abrasive grains and loose abrasive grains. A summarized hypothesis is drawn to describe the dynamically balanced state of the hybrid precision abrasive machining process, in which the 2-body abrasion and 3-body abrasion material removal mechanism participate simultaneously and interconvert to each other continuously. INDEX TERMS Material processing, sapphire substrate, tool manufacturing. I. INTRODUCTION A. MATERIAL AND MACHINING PROCESS Sapphire is the single crystal form of the compound Al 2 O 3 (α-alumina), and it is the second hardest natural material after diamond. As one of the most recognized highquality opto-mechatronic materials in the industry, it has been used broadly in various fields covering consumer electronics and military equipment. For instance, because of the superior material properties in physical strength, hardness, and The associate editor coordinating the review of this manuscript and approving it for publication was Bora Onat. high-temperature resistance, sapphire possesses the capability to endure the severe conditions of GaN film deposition, and which make sapphire became the predominate substrate material for light emitting diode (LED) applications [1]-[3]. Moreover, sapphire is also a wide gap (up to 0.9 eV) insulator presenting multiple favorable properties including the refractory behavior and transparency over a wide wavelength range, which enables sapphire to be employed as the laser diodes, optical materials or even insulator in a nuclear reactor [4], [5]. The machining process of sapphire substrate usually starts from the sawing of a sapphire cylinder bar of 50mm to 150mm in diameter, and following a sequence of precision

show abstract

“…On finished parts, the presence of edge chipping is detrimental to the mechanical characteristics as well as dimensional and geometrical accuracy, and often severely limits the productivity of ceramic machining processes. Some improvements in machinability of both structural and electronic ceramics were achieved by optimizing the conventional fixed abrasive machining processes [2]. Besides improvements in conventional processes, large reductions in cutting forces and edge chipping in ceramics fixed abrasive machining were achieved with ultrasonic oscillations of the cutting tool during machining [3].…”

Section: Introductionmentioning

confidence: 99%

Improvements in Machinability of Zinc Oxide Ceramics by Laser-Assisted Milling

Muženič

Dugar

Kramar

et al. 2019

SV-JME

View full text Add to dashboard Cite

In this paper, an attempt is made to advance the understanding of Laser-Assisted Milling (LAMill) of zinc oxide (ZnO) ceramics. A series of conventional milling and LAMill experiments with varying laser power were conducted to determine the effect of laser assistance on the machinability of this material. Improved machinability in terms of reduction in machined surface roughness and edge chipping was achieved by adjusting laser power. At an optimal laser power of 120 W, determined for the machining parameters used, R a and R z were reduced by 37 % and 46 %, respectively, while the average and maximum chipping widths were reduced by 15 % and 17 %, respectively.

show abstract

Fixed abrasive machining of non-metallic materials

Cited by 33 publications

References 87 publications

Evaluation of Chip Formation Mechanisms in the Turning of Sintered ZnO Electro-Ceramics

Evaluation of Chip Formation Mechanisms in the Turning of Sintered ZnO Electro-Ceramics

An Experimental Study on the Abrasive Machining Process of Electronic Substrate Material With A Novel Ultraviolet-Curable Resin Bond Diamond Lapping Plate

Improvements in Machinability of Zinc Oxide Ceramics by Laser-Assisted Milling

Contact Info

Product

Resources

About