An Experimental Study on the Abrasive Machining Process of Electronic Substrate Material With A Novel Ultraviolet-Curable Resin Bond Diamond Lapping Plate

Abstract

Sapphire is one of the most widely used electronic substrate materials in the industry. The manufacturing process of sapphire and such hard and brittle materials is extremely time and energy consuming because of their superior material properties in physical and chemical behaviors. In this study, the ultraviolet-curable resin is introduced into the fabrication of the diamond abrasive lapping plate as a bonding agent. A practical manufacturing process is established in the laboratory to develop an ultraviolet-curable resin bond fixed abrasive lapping plate for the precision machining of sapphire substrates, the machining performance of which is examined through a series of comparative experiments among the conventional fixed-abrasive lapping, the slurry-based lapping and this originally developed plate involved lapping. The surface topography and surface roughness of the machined sapphire workpieces are measured to evaluate the surface quality, and the weight loss of the workpieces in each machining process is recorded to estimate the respective machining efficiency. The promising results achieved from the ultraviolet-curable resin plate lapping process, in terms of a relatively higher material removal rate and better surface quality, indicate that the occurrence of a corporate action integrating both the advantages of the fixed abrasive grains and loose abrasive grains. A summarized hypothesis is drawn to describe the dynamically balanced state of the hybrid precision abrasive machining process, in which the 2-body abrasion and 3-body abrasion material removal mechanism participate simultaneously and interconvert to each other continuously. INDEX TERMS Material processing, sapphire substrate, tool manufacturing. I. INTRODUCTION A. MATERIAL AND MACHINING PROCESS Sapphire is the single crystal form of the compound Al 2 O 3 (α-alumina), and it is the second hardest natural material after diamond. As one of the most recognized highquality opto-mechatronic materials in the industry, it has been used broadly in various fields covering consumer electronics and military equipment. For instance, because of the superior material properties in physical strength, hardness, and The associate editor coordinating the review of this manuscript and approving it for publication was Bora Onat. high-temperature resistance, sapphire possesses the capability to endure the severe conditions of GaN film deposition, and which make sapphire became the predominate substrate material for light emitting diode (LED) applications [1]-[3]. Moreover, sapphire is also a wide gap (up to 0.9 eV) insulator presenting multiple favorable properties including the refractory behavior and transparency over a wide wavelength range, which enables sapphire to be employed as the laser diodes, optical materials or even insulator in a nuclear reactor [4], [5]. The machining process of sapphire substrate usually starts from the sawing of a sapphire cylinder bar of 50mm to 150mm in diameter, and following a sequence of precision

Applications of Additively Manufactured Tools in Abrasive Machining—A Literature Review

“…Nowadays, resin-bonded diamond abrasive tools prepared by this method, are widely used in the precision grinding or lapping of hard and brittle materials, such as technical ceramics. Application of resin lapping plates containing diamond abrasive grains in the machining of ceramic materials allowed obtaining a lower average value of roughness parameter Ra [ 97 ] and higher material removal rate [ 98 ] compared to the conventional slurry-based lapping process with a cast iron plate. The experimental results presented in [ 97 ] showed a significant improvement in surface roughness and reduction in material removal rate during the lapping of a ceramic workpiece and with the use of a resin-bonded tool.…”

Fabrication of vitrified bond diamond grinding wheel via UV-curing

“…This approach offers the possibility of producing complex structures without the need for molds, reducing long production cycles. 3D printing technologies applied in diamond tool applications primarily include selective laser sintering (SLS) [16], selective laser melting (SLM) [17,18], direct ink writing (DIW) [19], and photopolymerization-based methods (stereolithography, SLA, and digital light processing, DLP) [20,21]. Among these techniques, laser sintering methods are mainly used for metal-bond diamond tools.…”

Digital light processing based additive manufacturing of resin bonded SiC grinding wheels and their grinding performance

“…Such tools have been proved to have substantial advantages over conventional abrasive tools [16,17]. Guo und Du et al [10,18] used a strong ultravioletcurable resin bond for a diamond lapping plate and compared it with a conventionally manufactured lapping plate. The results showed not only a higher material removal rate but also a ner surface.…”