Finite Element simulation of inkjet printed strain gage on polyimide substrates applied to flexible boards

Manufacturing Technology (MATES) II. Task Order 0006: Air Force Technology and Industrial Base Research Sub-Task 07: Future Advances in Electronic Materials and Processes-Flexible Hybrid Electronics

“…Mechanical EDA tools, such as Solidworks Simulation, are beginning to incorporate finite element (FE) simulation algorithms to help simulate board fatigue and failure scenarios under inflexible components so that designers can take proactive steps during the initial design phase to increase board reliability. [774] By simulating areas of the board that are subject to high levels of mechanical stress, potential failure scenarios and the impact of design solutions, such as strain relief and board stiffeners, can be investigated to help prevent failures postmanufacturing. Such tools also often incorporate thermal simulation in addition to mechanical bending to better model the impact of heat deformation on the flexible substrate and mounted parts.…”

Direct and Indirect Strain Measurement of Flexible Printed Circuit Boards - fPCBs

“…The Finite Element Simulation [4] was able to simulate the linear and nonlinear behavior of inkjet print strain gage (Figures 6 and 7). Considering experimental and FEM simulation analysis it's possible to observe that this technology could be employed onto practical problems in polyimide substrate.…”

“…The high speed camera [5] features superior basic performance with mega pixel resolution, an ultrasensitive image sensor capable of clear recording in low-light, and an ultra-high speed frame rate of a maximum of 675000 fps (see Figure 9). Engineering Solutions for Manufacturing Processes Figure 11 shows an fPCB sample employed in the experimental testing using the HSC measurement system [4]. The board must be painted in white with black spots as shown.…”

“…Additive technologies offer lower cost, less production steps, and capability for mass production [3]. Printed electronics takes advantage of nano-sciences and material development, piggybacking them onto printing technologies which have developed quite much during past years [4].Within this scenario, printed electronics can be an option to produce strain sensors since it has already demonstrated its capability also for manufacturing of high-speed electronics and low cost products through an additive process. The technology also allows the printing of a sensor directly over the tested sample.…”