Direct and Indirect Strain Measurement of Flexible Printed Circuit Boards - fPCBs

Abstract

This work is related to reliability of strain measurement in flexible printed circuit boards (fPCBs) made with polyimide substrate. It was observed that the fPCBs are very sensitive to strain mounting stiffness. The indirect measurement method will be done employing High Speed Camera (HSP). The direct method will be formulated in two ways: 1) conventional strain gauge glued in an fPCBs; 2) printed strain gauge in a polyimide substrate. This paper will point out mistakes and show advantages when using different method to extract the deformation field of the selected area in a flexible thin film.