Finite element modeling of tube hydroforming of polycrystalline aluminum alloy extrusions

“…Kashani Zadeh and Mashhadi (2006) used finite element simulations to quantify the effects of coefficient of friction, strain hardening exponent, and fillet radius on the parameters, protrusion height, thickness distribution, and clamping an axial forces. Guan et al (2006) developed and implemented a polycrystalline model into a finite element program and calculated texture evolution on several aluminum hydroformed components. Heo et al (2006) used ANSYS parametric design language to design an adaptive FEM simulation for determination of a suitable hydroforming load path.…”

Section: Introductionmentioning

confidence: 99%

Internal state variable plasticity-damage modeling of the copper tee-shaped tube hydroforming process

Crapps

Marin

Horstemeyer

et al. 2010

Journal of Materials Processing Technology

View full text Add to dashboard Cite

“…Crystal plasticity finite element modeling algorithms account for the effect of microstructure and slip mechanisms that influence the plastic deformation in crystalline materials [23][24][25][26][27][28][29][30]. Models such as the one briefly described in Chap.…”

Section: Estimating Microstructure Evolution With Modelingmentioning

confidence: 99%

Challenges in Future-Generation Interconnects: Microstructure Again

Lee

Bieler

Kim

et al. 2014

Fundamentals of Lead-Free Solder Interconnect Technology

View full text Add to dashboard Cite

The aim of this chapter is not to introduce the packaging technology of the future nor the challenges in specific packaging structure. Rather, it is to review the characteristics of technology on the horizon along with the introduction of materials under consideration, briefly consider possible problems associated with such technology, and stress the need for understanding more on the solder itself. For this, this chapter firstly discusses the need for considering new boundary condition of the interconnects that arise from the use of electronics in harsher environment in a small form factor. It is followed by the discussion on the packaging challenges in higher power devices such as the power handling devices and LEDs. Then, material challenges associated with device miniaturization as well as the increased current density in solder interconnects are presented. Finally, the need for and difficulty in developing multiscale model for solder joint property and its behaviors in packaging structure is briefly discussed in order to reemphasize the urgency of achieving more advanced understanding of the Pb-free solder materials in general. Future Packaging and Next-Generation Interconnects: KeywordsThe keywords for future packaging and next-generation interconnects are smaller form factor, higher performance, flexible in form factor and applications, and lower power consumption than the devices used in today's technology. Demand for such devices emerges as electronic devices are increasingly used in unconventional places, and this trend will only increase in the foreseeable future. Such devices will be designed with miniaturization, wider applications, extreme environments, wearable electronics, low power, flexible, more functionality, vertical stacking and 3D architectures, active thermal management, and high current density as design goals and constraints. Critical issues in relation to the development of such devices include the power device package design, MEMS, 3D wafer-level packages, complex

show abstract

Finite element modeling of tube hydroforming of polycrystalline aluminum alloy extrusions

Cited by 41 publications

References 85 publications

Hydroforming of anisotropic aluminum tubes: Part II analysis

Hydroforming of anisotropic aluminum tubes: Part II analysis

Internal state variable plasticity-damage modeling of the copper tee-shaped tube hydroforming process

Challenges in Future-Generation Interconnects: Microstructure Again

Contact Info

Product

Resources

About