Fine-line conductor manufacturing using drop-on demand PZT printing technology

Szczech, John; Megaridis, Constantine M.; Gamota, Daniel; Zhang, Jie

doi:10.1109/tepm.2002.1000480

Cited by 173 publications

(96 citation statements)

References 9 publications

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“…Experiments using more concentrated metal colloids are underway with the objective of electrohydrodynamic deposition of even finer conductive tracks. (29) colloid solution 3nm -5μm Laser direct write (30) Gold Ink --8μm Ink-jet Printing (7) Gold nanoparticles in toluene 2-5nm 30 15μm Ink-jet Printing (31) Gold nanoparticles in toluene 2-4nm 30 20μm Ink-jet Printing (32) Gold nanoparticles in toluene 5-20nm 30-50 100μm Ink-jet Printing (33) Gold nanoparticles in toluene 2-4nm 30 125μm Ink-jet Printing (34) Silver nanoparticles in ␣-terpineol 5-7nm 10 100μm Ink-jet Printing (35) Silver nanoparticles in toluene 1-10nm 30 120μm Ink-jet Printing (36) Silver ink in xylene -16 160μm Ink-jet Printing (37) Silver nanodispersion 50nm 8 1.5mm Microcontact Printing (38) Copper --500nm Chemical Vapor Deposition (39) Copper --1μm…”

Section: Resultsmentioning

confidence: 99%

Printing gold nanoparticles with an electrohydrodynamic direct-write device

et al. 2006

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A dispersion containing 15nm gold particles in ethanol was subjected to electrohydrodynamic atomization, producing droplets with an average size of ~2 6m as measured by laser diffraction. An electrohydrodynamic direct-write device was used to deposit the dispersion onto silicon wafers with the intention of printing gold tracks. Immediately after deposition ethanol evaporated, leaving the gold particles organised in a ~7 5m wide central region surrounded by two regions, each ~5 0m wide, at the edge of which two further gold tracks, each ~7 m existed.

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Section: Resultsmentioning

confidence: 99%

Printing gold nanoparticles with an electrohydrodynamic direct-write device

et al. 2006

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“…It is ever more important that new alternatives to lithographic process are under development to make thin films on large-areas or mesoscale patterns with fine pitch [4]. In particular, direct printing of metallic colloidal suspensions has received steadily growing interest for both scientific and industrial applications [5][6][7]. In the past few years, the technologies using metallic nanoparticles underwent major progresses thanks to achievements in inks development, printing and sintering tools.…”

Section: Introductionmentioning

confidence: 99%

Microstrain and Residual Stress in Thin-Films Made from Silver Nanoparticles Deposited by Inkjet-Printing Technology

Cauchois

Borbély²,

Gergaud

et al. 2014

AMR

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Abstract. Colloidal suspensions of nanoparticles are increasingly employed in the fabrication process of electronic devices using inkjet-printing technology and a consecutive thermal treatment. The evolution of internal stresses during the conversion of silver nanoparticle-based ink into a metallic thin-film by a thermal sintering process has been investigated by in-situ XRD using the sin 2 ψ method. Despite the CTE mismatch at the film/substrate interface, the residual stress in silver films (below 70 MPa) remains lower than in conventional PVD thin-films, as a result of the remaining porosity. A Warren-Averbach analysis further showed that the crystallite growth is associated with a minimization of the twin fault density and the elastic microstrain energy above 150°C. A stabilization of the microstructure and internal stress is observed above 300°C. Inkjetprinting technology thus appears as a good alternative to conventional metallization techniques and offers significant opportunities asset for interconnect and electronic packaging.

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“…Another method that have been used for the direct-write farbrication of electric circuit is direct ink-jet printing of metallo-organic decomposition inks [3], metal nanoparticle inks or mixtures of the two and subsequent thermal decomposition and sintering to yield metal thin films. In this case, however, the required thermal treatment at temperatures in excess of 300 o C precludes the use of thermally-sensitive substrates such as polymers in addition to the challenge of formulating such inks and ensuring adequate adhesion between the metal film and the substrate [4].…”

Section: Introductionmentioning

confidence: 99%

Low Temperature Direct-Write Fabrication of Radio Frequency Identification Circuit and Antenna Structures on Polymer Substrates

Alu¹,

Oberafo²,

Iwok³

et al. 2014

IJMSA

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Abstract:We report the direct-write fabrication of electric circuits on polyethylene terephthalate (PET) substrates by a low temperature technique. To demonstrate the utility of the concept, Radio Frequency Identification Circuit and Antenna Structures were fabricated on polyethylene terephthalate (PET), using a 300 dpi drop-on-demand HP DeskJet system. First, each substrate was prepared by low frequency atmospheric plasma etching, followed by tin (II) chloride treatment to enhance wetting. Then a catalytic silver seed layer pattern was bubble-jet printed onto the surface. Finally, the substrate was developed in a copper electroless plating bath for 10 min. to yield a 2.5 µm copper film with a sheet resistance of 3.4 Ωsq. The as-deposited film was shiny with a surface roughness of less than 8.7nm, which is about 0.35% of the film thickness. The films were characterized by SEM, EDX, profilometry, optical microscopy, and four-point probe resistivity measurement. This technology may be adapted for the direct-write fabrication of antenna structures for communication devices and space science applications.

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Fine-line conductor manufacturing using drop-on demand PZT printing technology

Cited by 173 publications

References 9 publications

Printing gold nanoparticles with an electrohydrodynamic direct-write device

Printing gold nanoparticles with an electrohydrodynamic direct-write device

Microstrain and Residual Stress in Thin-Films Made from Silver Nanoparticles Deposited by Inkjet-Printing Technology

Low Temperature Direct-Write Fabrication of Radio Frequency Identification Circuit and Antenna Structures on Polymer Substrates

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