Microstrain and Residual Stress in Thin-Films Made from Silver Nanoparticles Deposited by Inkjet-Printing Technology

Abstract

Abstract. Colloidal suspensions of nanoparticles are increasingly employed in the fabrication process of electronic devices using inkjet-printing technology and a consecutive thermal treatment. The evolution of internal stresses during the conversion of silver nanoparticle-based ink into a metallic thin-film by a thermal sintering process has been investigated by in-situ XRD using the sin 2 ψ method. Despite the CTE mismatch at the film/substrate interface, the residual stress in silver films (below 70 MPa) remains lower than in conventional PVD thin-films, as a result of the remaining porosity. A Warren-Averbach analysis further showed that the crystallite growth is associated with a minimization of the twin fault density and the elastic microstrain energy above 150°C. A stabilization of the microstructure and internal stress is observed above 300°C. Inkjetprinting technology thus appears as a good alternative to conventional metallization techniques and offers significant opportunities asset for interconnect and electronic packaging.

Residual strain orientation in rolled titanium determined with synchrotron X-ray Laue microdiffraction

“…Bulk properties can be measured with neutron diffraction due to its great penetration depth (Krawitz & Holden, 1990;Robinson et al, 2017;Noyan et al, 2020;Wissink et al, 2020). X-ray diffraction (XRD) has been used as a nondestructive method (Unga ´r & Borbe ´ly, 1996; Unga ´r et al, 2001;Cauchois et al, 2014). Single-crystal properties can be measured using synchrotron X-ray microdiffraction (mXRD) (Tamura et al, 2002;Levine et al, 2006;Renversade & Borbe ´ly, 2017;Morawiec, 2018).…”