Field and temperature acceleration model for time-dependent dielectric breakdown

Kimura, Mikihiro

doi:10.1109/16.737462

Cited by 87 publications

(43 citation statements)

References 30 publications

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“…On the other hand, high temperature enhances gate oxide breakdown, which is a strong function of temperature and electric field [17]. In our stress experiments, however, no noticeable increase in gate leakage current was detected when V DD2 was stressed at 3.5, 4, and 4.5 V. This suggests that no transistor oxide hard breakdown occurred since hard breakdown typically results in a sudden surge of gate current [18], [19] and could collapse RF performances.…”

Section: Physical Insight Through the Mixed-mode Device And Circumentioning

confidence: 58%

Experimental Verification of RF Stress Effect on Cascode Class-E PA Performance and Reliability

Yuan

Yen

Chen

et al. 2012

IEEE Trans. Device Mater. Relib.

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Abstract-A cascode class-E power amplifier (PA) operating at 5.2 GHz has been designed using Advanced Design System simulation. RF circuit performances such as output power and power-added efficiency before and after RF stress have been experimentally investigated. The measured output power, power-added efficiency, and linearity after high-input-power RF stress at elevated supply voltage show significant circuit degradations. The impact of hot-carrier injection and gate oxide soft breakdown on cascode class-E PA reliability is discussed.Index Terms-Cascode class E, gate oxide breakdown, output power, power amplifier (PA), power efficiency, reliability.

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Section: Physical Insight Through the Mixed-mode Device And Circumentioning

confidence: 58%

Experimental Verification of RF Stress Effect on Cascode Class-E PA Performance and Reliability

Yuan

Yen

Chen

et al. 2012

IEEE Trans. Device Mater. Relib.

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“…temperature, voltage or pressure), and then the collected data is extrapolated through a physically reasonable statistical model to estimate the reliability of the system at lower, normal use conditions. These models are especially important in the context of highly reliable items, where it is often virtually impossible to demonstrate that a reliability goal has been attained (Nelson 1990;Kimura 1999).…”

Section: Accelerated Failure Time Modelmentioning

confidence: 99%

Reliability and maintainability performance under Arctic conditions

Barabadi

Markeset

2011

Int J Syst Assur Eng Manag

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Operational environments may have a considerable influence on the reliability performance and maintainability performance of an item. In the Arctic region with harsh climate condition, sensitive environment and remote location, these influences are more critical. To achieve effective reliability and maintainability analysis and management, all technical challenges and influence factors must be identified. Then, based on the way that these factors influence the failure mechanisms, maintenance processes and other support activities, appropriate statistical approaches must be selected to quantify their effects. The first part of this paper reviews the technical challenges for the offshore oil and gas industry from the reliability and maintainability performance perspective in the Arctic region. The second part of this paper reviews the available appropriate statistical approach for reliability and maintainability performance analysis under Arctic conditions.

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“…It manifests itself both in the gate stack of devices and across wires of an integrated system. We also assume two modeling papers: one for TDDB manifestation on wires [Bekiaris et al 2011] and one for devices [Kimura 1999]. In case we would like to systematically classify these two papers, we should further split the "irreversible mechanism" leaf of our classification framework (see Figure 10) into two complementary categories.…”

Section: Reusability and Extensibility Of The Proposed Classificationmentioning

confidence: 99%

“…An example of accumulating physical mechanisms that may cause reliability violations is time-dependent dielectric breakdown (TDDB). A modeling attempt can be found in Kimura [1999]. A series of experimental measurements yields formal correlations between the cumulative failure of the tested devices and TDDB intensity metrics.…”

Section: Platform-inherent Reliability Violationsmentioning

confidence: 99%

Classification Framework for Analysis and Modeling of Physically Induced Reliability Violations

Rodopoulos¹,

Psychou

Sabry

et al. 2015

ACM Comput. Surv.

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Technology downscaling is expected to amplify a variety of reliability concerns in future digital systems. A good understanding of reliability threats is crucial for the creation of efficient mitigation techniques. This survey performs a systematic classification of the state of the art on the analysis and modeling of such threats, which are caused by physical mechanisms to digital systems. The purpose of this article is to provide a classification tool that can aid with the navigation across the entire landscape of reliability analysis and modeling. A classification framework is constructed in a top-down fashion from complementary categories, each one addressing an approach on reliability analysis and modeling. In comparison to other classifications, the proposed methodology approaches the target research domain in a complete way, without suppressing hybrid works that fall under multiple categories. To substantiate the usability of the classification framework, representative works from the state of the art are mapped to each appropriate category and are briefly analyzed. Thus, research trends and opportunities for novel approaches can be identified.

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Field and temperature acceleration model for time-dependent dielectric breakdown

Cited by 87 publications

References 30 publications

Experimental Verification of RF Stress Effect on Cascode Class-E PA Performance and Reliability

Experimental Verification of RF Stress Effect on Cascode Class-E PA Performance and Reliability

Reliability and maintainability performance under Arctic conditions

Classification Framework for Analysis and Modeling of Physically Induced Reliability Violations

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