Femtosecond ablation of ultrahard materials

Dumitru, G.; Romano, Valerio; Weber, H. P.; Sentís, M.; Marine, W.

doi:10.1007/s003390101183

Cited by 182 publications

(93 citation statements)

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“…The values of ablation threshold measured with this technique agree with the ones given by the traditional method (Freitas et al, 2010;. Once the ablation threshold is known, ultrashort pulses can be used in a variety of materials ranging from transparent dielectrics (Gattass & Mazur, 2008) to metals (Dumitru et al, 2002;Itoh et al, 2006;Ke et al, 2005;Shirk & Molian, 1998), semiconductors (Nayak et al, 2007) and polymers (Baudach et al, 2000), to drill holes and to machine the material in a controlled way to modify its surface (Zoubir et al, 2003), create microstructures (Kruger & Kautek, 1999;Sugioka et al, 2005) and microchannels (Gomez et al, 2005). Due to the nonthermal character of the ablation, the heat affected zone is minimized, and can be brought to be almost nonexistent, allowing the use of ultrafast pulses to perform surgeries (Vogel et al, 2005;Vogel & Venugopalan, 2003) like neuron severing without damaging neighboring living tissues (Chung et al, 2006) and corneal cutting as high precision scalpels (Juhasz et al, 1999), among other application in biological samples and tissues (Braun et al, 2008).…”

Section: Ionization By Ultrashort Pulsessupporting

confidence: 72%

Ultrashort Laser Pulses Applications

Samad¹,

Courrol²,

Baldochi³

et al. 2010

Coherence and Ultrashort Pulse Laser Emission

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Section: Ionization By Ultrashort Pulsessupporting

confidence: 72%

Ultrashort Laser Pulses Applications

Samad¹,

Courrol²,

Baldochi³

et al. 2010

Coherence and Ultrashort Pulse Laser Emission

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“…A detailed description of the formation and growth of micro/nanostructures using femtosecond laser pulses in multiple atmospheric environments including SF 6 has been published for silicon [3,10,24,25,[27][28][29][30][31], including the well-known "black silicon" [4,[24][25][26]. In addition to silicon, the formation of micro/nanostructures using femtosecond pulses has been studied on a number of metals [13,16,[32][33][34][35][36][37][38][39][40][41][42][43][44], and in different atmospheres [45]. However, although multiple structure types ranging from LIPSS to complex multi-scale features have been fabricated on metals [14,23,32,[38][39][40]46,47], a detailed understanding of the effect of laser processing parameters (e.g.…”

Section: Introductionmentioning

confidence: 99%

Formation of multiscale surface structures on nickel via above surface growth and below surface growth mechanisms using femtosecond laser pulses

2013

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"Formation of multiscale surface structures on nickel via above surface growth and below surface growth mechanisms using femtosecond laser pulses" (2013 Abstract:The formation of self-organized micro-and nano-structured surfaces on nickel via both above surface growth (ASG) and below surface growth (BSG) mechanisms using femtosecond laser pulse illumination is reported. Detailed stepped growth experiments demonstrate that conical mound-shaped surface structure development is characterized by a balance of growth mechanisms including scattering from surface structures and geometric effects causing preferential ablation of the valleys, flow of the surface melt, and redeposition of ablated material; all of which are influenced by the laser fluence and the number of laser shots on the sample. BSG-mound formation is dominated by scattering, while ASG-mound formation is dominated by material flow and redeposition. This is the first demonstration to our knowledge of the use of femtosecond laser pulses to fabricate metallic surface structures that rise above the original surface. These results are useful in understanding the details of multi-pulse femtosecond laser interaction with metals.

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“…Para determinar la densidad de energía umbral para la ablación directa (F th ) empleamos una técnica basada en la focalización sobre la superficie del material del patrón de difracción del haz láser por una abertura circular de diámetro D inferior al de su sección transversal [15]. En ese caso, la distribución de energía sobre la superficie corresponde a la función de Airy, con un disco central con el máximo de densidad de energía (F 0 ) y unos anillos concéntricos de energía decreciente, cuyos radios dependen del diámetro de la apertura interpuesta y de la longitud de onda del láser.…”

Section: Umbral De Ablación Directaunclassified

Micromecanizado de materiales cerámicos mediante láser de femtosegundo

Moreno¹,

Méndez²,

García³

et al. 2005

Bol. Soc. Esp. Ceram. Vidr.

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En este trabajo presentamos la aplicación de pulsos láser ultracortos (110 fs @ 1 kHz; hasta 1.1 mJ/pulso) al micromecanizado de materiales cerámicos, en concreto Rubalit TM 708S, un material compuesto principalmente de alúmina y empleado en la industria microelectrónica. El mecanismo de eliminación de material es la ablación directa, que difiere de la ablación térmica empleada por los láseres convencionales en la prácticamente total ausencia de efectos térmicos, lo que redunda en un aumento significativo de la precisión y calidad del mecanizado. Mediante técnicas basadas en la difracción óptica determinamos el umbral de energía necesario para que tenga lugar el proceso de ablación directa. Con ese dato y regulando la energía por pulso y el número de pulsos somos capaces de producir mecanizados del diámetro y profundidad deseados. Además, el procesado se realiza en aire. Demostramos que es posible ejecutar micromecanizado de calidad mediante este procedimiento en cualquier material cerámico, independientemente de sus propiedades mecánicas, variando ligeramente los parámetros del proceso. En este caso, además de la alúmina hemos procesado SiN sinterizado, un material de uso extendido en la industria.Palabras Clave: Ablación. Láser de femtosegundo. Alúmina. Femtosecond laser micromachining of ceramicsIn this work, we present the application of ultrashort and intense laser pulses (110 fs @ 1 kHz; up to 1.1 mJ/pulse) to the micromachining of ceramics, specifically Rubalit TM 708S, a material based on alumina and widely used as a substrate in microelectronics. The mechanism for removing material is the so called direct ablation. It differs from thermal ablation of conventional lasers in the practically total absence of thermal effects which produces a remarkable increase of quality and precision of the machining. By means of an optical diffraction-based technique we find out the energy density threshold to work in the direct ablation regime. Adjusting the energy per pulse as well as the number of pulses, we are able to drill holes of the desired diameter and depth. In addition, processing is developed in air. We also demonstrate that high quality fs-laser micromachining is suitable for every ceramic, whatever the mechanical properties, with similar working parameters. In order to show this point, we have also processed sintered SiN, a material of wide-ranging interest in industry.Keywords: Ablation. Femtosecond laser. Alumina. IntroduccIónDesde el desarrollo de los primeros láseres hace más de cuatro décadas, las aplicaciones de esta herramienta en los más variados campos científicos y tecnológicos han sido innumerables [1]. El espectacular avance de los conocimientos sobre los procesos no lineales en materiales, junto al de la optoelectrónica, ha permitido disponer muy recientemente de fuentes de radiación láser que son capaces de emitir pulsos de muy corta duración y suficiente energía que, convenientemente focalizados, dan lugar a densidades de energía capaces de producir la ablación directa de materiales sólidos ...

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Femtosecond ablation of ultrahard materials

Cited by 182 publications

References 1 publication

Ultrashort Laser Pulses Applications

Ultrashort Laser Pulses Applications

Formation of multiscale surface structures on nickel via above surface growth and below surface growth mechanisms using femtosecond laser pulses

Micromecanizado de materiales cerámicos mediante láser de femtosegundo

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