FE-investigation of the stress/strain and fracture mechanics properties of intermetallic phase regions in leadfree solder interconnects

Miillera, W.H.; Hannach, T.; Albrecht, H.

doi:10.1109/eptc.2006.342701

Cited by 6 publications

(2 citation statements)

References 6 publications

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“…Another fundamental difference between the two structures is that, the bonding mechanism of BOC is basically an interfacial attachment. The instance of interfacial cracking at the bump to solderpad interface has been well documented [3]. With the BOL structure solder also bonds to the edges of the trace which creates a more robust interconnect with no observed cases of substrate pad to bump pad interfacial failures.…”

Section: Trend Of Interconnectionmentioning

confidence: 96%

Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure

Ouyang¹,

Chae²,

Chow³

et al. 2010

International Symposium on Microelectronics

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In this paper, a novel flip chip interconnect structure called Bond-On-Lead (BOL) and its ability to reduce stress in the sensitive sub-surface ELK (Extra Low K) layers of the die is presented. BOL is a new low cost flip chip packaging solution which was developed by STATSChipPAC to dramatically reduce the cost of flip chip packaging. The BOL solution allows for efficient substrate routing by virtue of the use of narrow BOL pads and the removal of solder mask in the area of the BOL pads, which eliminates the limitations associated with solder mask opening sizes and positional tolerances. In addition to the compelling cost benefits, modeling results are confirmed with empirical reliability testing data to show that BOL is superior to the traditional Bond-on-Capture Pad (BOC) configuration from a mechanical stress and reliability perspective. The focus of this paper is on the theoretical analysis of the stress, strain, and warpage associated with the BOL configuration compared with the traditional BOC structure. For the package deformation, the global finite element method is used to simulate the package warpage. For the local bumping reliability, the focus is on the ELK layers which are the critical locations affecting the package's reliability. The local finite element simulation is conducted to compare the critical ELK layers stresses with BOL structure vs. with traditional BOC structure.

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Section: Trend Of Interconnectionmentioning

confidence: 96%

Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure

Ouyang¹,

Chae²,

Chow³

et al. 2010

International Symposium on Microelectronics

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“…Another approach is to treat the IMC layer as an elastic continuum layer that has a thickness and different mechanical properties compared with the solder alloy [5,6]. This approach was applied to investigate the effect of the IMC growth on the strength of the solder joint by finite element method [7][8][9]. However, the simulation results do not agree well with the experimental findings, because these approaches are incapable to consider the grain microstructure and the randomly distributed grain boundary defects in the IMC layer.…”

Section: Introductionmentioning

confidence: 99%

Numerical simulation of the intermetallic compound cracking in solder joint

Qin

2014

2014 15th International Conference on Electronic Packaging Technology

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The microcracking behavior of the IMC layer is investigated numerically, and the effect of the thickness of the IMC layer on the overall response and failure mode of the solder joint is studied using qualitative numerical simulations. The results show that the thicker IMC layer results in lower overall strength. When the IMC layer is thin, the microcracks tend to start at the valley of the rough solder/IMC interface and propagate across the root of the protruding Cu6Sn5 grains; when the IMC layer is thick, the microcracks tend to occur within the IMC layer. These predictions agree well with experimental observations. Keywords-solder joint; intermetallic compound (imc); microcracking behavior; finite element methodI.

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Intergranular cracking simulation of the intermetallic compound layer in solder joints

Qin

2013

Computational Materials Science

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FE-investigation of the stress/strain and fracture mechanics properties of intermetallic phase regions in leadfree solder interconnects

Cited by 6 publications

References 6 publications

Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure

Improvement of ELK Reliability in Flip Chip Packages using Bond-on-Lead (BOL) Interconnect Structure

Numerical simulation of the intermetallic compound cracking in solder joint

Intergranular cracking simulation of the intermetallic compound layer in solder joints

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