Intergranular cracking simulation of the intermetallic compound layer in solder joints

An, Tong; Qin, Fei

doi:10.1016/j.commatsci.2013.05.044

Cited by 25 publications

(14 citation statements)

References 36 publications

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“…Dimples are formed as a result of coalescence of micro voids during plastic deformation [35]. As a consequence, solder surface tear along the shear direction resulting in tear ridges [34]. Also, in accordance with the earlier reports [36][37][38], the dimple size increases significantly with the aging time as seen in Figure 9b Figure 9e shows the crack propagating along the Cu 6 Sn 5 IMC beneath the solder.…”

Section: Effect Of Zro2 Nanoparticle Size On the Shear Strength And Fsupporting

confidence: 84%

“…Figure 9 shows the top view of the fractured surface of as-reflowed and aged SAC 305-ZrO 2 A/Cu joints after the shear test. When tensile or shear tests are conducted on solder joints, fracture propagation mainly occurs in three general modes [22,[32][33][34]. Mode 1-A typical ductile fracture where the cracks start at the solder/Cu joint and propagates within the solder.…”

Section: Effect Of Zro2 Nanoparticle Size On the Shear Strength And Fmentioning

confidence: 99%

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Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

Rajendran

Hwang

Jung

2020

Metals

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This study investigates the shear strength and aging characteristics of Sn-3.0Ag-0.5Cu (SAC 305)/Cu joints by the addition of ZrO2 nanoparticles (NPs) having two different particle size: 5–15 nm (ZrO2A) and 70–90 nm (ZrO2B). Nanocomposite pastes were fabricated by mechanically mixing ZrO2 NPs and the solder paste. ZrO2 NPs decreased the β-Sn grain size and Ag3Sn intermetallic compound (IMC) in the matrix and reduced the Cu6Sn5 IMC thickness at the interface of lap shear SAC 305/Cu joints. The effect is pronounced for ZrO2A NPs added solder joint. The solder joints were isothermally aged at 175 °C for 24, 48, 144 and 256 h. NPs decreased the diffusion coefficient from 1.74 × 10–16 m/s to 3.83 × 10–17 m/s and 4.99 × 10–17 m/s for ZrO2A and ZrO2B NPs added SAC 305/Cu joints respectively. The shear strength of the solder joints decreased with the aging time due to an increase in the thickness of interfacial IMC and coarsening of Ag3Sn in the solder. However, higher shear strength exhibited by SAC 305-ZrO2A/Cu joints was attributed to the fine Ag3Sn IMC’s dispersed in the solder matrix. Fracture analysis of SAC 305-ZrO2A/Cu joints displayed mixed solder/IMC mode upon 256 h of aging.

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Section: Effect Of Zro2 Nanoparticle Size On the Shear Strength And Fsupporting

confidence: 84%

Section: Effect Of Zro2 Nanoparticle Size On the Shear Strength And Fmentioning

confidence: 99%

Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

Rajendran

Hwang

Jung

2020

Metals

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“…10. A similar dependency was found by An et al [45] in a numerical study on polycrystalline intermetallic compounds, where an increase in the variation of interfacial strength leads to a decrease in the overall strength. Fig.…”

Section: Interfacial Grain Boundary Strengthsupporting

confidence: 73%

Numerical analysis of the strength of polycrystalline diamond as a function of microstructure

McNamara

Alveen

Carolan

et al. 2015

International Journal of Refractory Metals and Hard Materials

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“…The four-node cohesive interface elements implemented via the UEL subroutine capability of ABAQUS were embedded along all of the polygonal boundaries to simulate the initiation, propagation and coalescence of microcracks. The finite element analysis is described in detail elsewhere [11]. The interface element behavior is governed by a traction-separation relationship specified by a modified exponential cohesive zone law proposed by Van den Bosch et al [12]: where n and t are the normal and tangential separating displacements, respectively; cr,n and cr,t are the critical separating displacements in the normal and tangential directions, respectively; n and t are two cohesive energies corresponding to the pure opening and shearing modes, respectively, and the values of n and t are the areas below the traction-separation curves.…”

Section: A Effect Of Imc Growth On Tensile Strength Of Solder Jointmentioning

confidence: 99%

Numerical simulation of the intermetallic compound cracking in solder joint

Qin

2014

2014 15th International Conference on Electronic Packaging Technology

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The microcracking behavior of the IMC layer is investigated numerically, and the effect of the thickness of the IMC layer on the overall response and failure mode of the solder joint is studied using qualitative numerical simulations. The results show that the thicker IMC layer results in lower overall strength. When the IMC layer is thin, the microcracks tend to start at the valley of the rough solder/IMC interface and propagate across the root of the protruding Cu6Sn5 grains; when the IMC layer is thick, the microcracks tend to occur within the IMC layer. These predictions agree well with experimental observations. Keywords-solder joint; intermetallic compound (imc); microcracking behavior; finite element methodI.

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Intergranular cracking simulation of the intermetallic compound layer in solder joints

Cited by 25 publications

References 36 publications

Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

Shear Strength and Aging Characteristics of Sn-3.0Ag-0.5Cu/Cu Solder Joint Reinforced with ZrO2 Nanoparticles

Numerical analysis of the strength of polycrystalline diamond as a function of microstructure

Numerical simulation of the intermetallic compound cracking in solder joint

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