2018
DOI: 10.1007/s10825-017-1125-1
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FDTD algorithm to achieve absolute stability in performance analysis of SWCNT interconnects

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Cited by 12 publications
(9 citation statements)
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“…Therefore, researchers are working to design the infrastructure, circuits, processes and interconnections. [44][45][46] To date, CNT thin-film FETs have been intensively…”
Section: Inverter and Ternary Content-addressable Memory Based On Car...mentioning
confidence: 99%
See 1 more Smart Citation
“…Therefore, researchers are working to design the infrastructure, circuits, processes and interconnections. [44][45][46] To date, CNT thin-film FETs have been intensively…”
Section: Inverter and Ternary Content-addressable Memory Based On Car...mentioning
confidence: 99%
“…Therefore, researchers are working to design the infrastructure, circuits, processes and interconnections. [ 44–46 ] To date, CNT thin‐film FETs have been intensively studied in multiple application areas, including several basic logic and storage devices, [ 47–53 ] synaptic devices, [ 54–57 ] healthcare devices, [ 58,59 ] radio frequency technology, [ 60,61 ] biosensing and detection technology, [ 62–65 ] communication engineering, [ 66,67 ] electrical applications, such as compressor, [ 68 ] ultralow power device, [ 69 ] AC amplifier, [ 70 ] and display electronics, [ 71 ] and so on. In the case of TCAM, as far as we know, the hybrid method of making TCAM has not been tried.…”
Section: Introductionmentioning
confidence: 99%
“…Because of the high mobility of electrons movement near ballistic transport and high driving capacity and smaller area, the CNTFETs are become promising alternate for CMOS technology especially when the device scaled at nanometer range. The authors [21][22][23][24][25][26] revealed that CNTFET outperforms compared to CMOS for both circuits and transmission lines. The positive feedback logic shown superior performance in the design of BCAM cells and other circuits needed to realize the BCAM array such as priority encoder, decoder and other logic gates [27,28].…”
Section: Fig1 General 4x4 Bcam Arraymentioning
confidence: 99%
“…Hence, increasing the amount of power dissipation integrated circuits. As improvement in technology or scaling will leads to have also provides in a significant may increase in parasitic in interconnects wires [6][7][8][9][10][11][12]. Inductive effect and capacitive coupling effect gives interconnect wire coupling crosstalk significant and cause many signal integrity problems.…”
Section: Introductionmentioning
confidence: 99%