Fatigue Testing Machine of Micro-Sized Specimens for MEMS Applications

This paper reports on the results of comparing different types of tensile testing methods that are used to evaluate thin-film properties. We tested the same material fabricated on a single wafer using different testing techniques at five different research institutions. The testing methods were different in the way the specimen was gripped. Materials tested were single-crystal silicon (SCS), polysilicon, nickel, and titanium films. Specimens with three different shapes were processed through the same fabrication steps. The tensile strength, fracture strain, and Young's modulus of the films were measured and compared. The measured values of the mechanical properties of all the testing methods were in good agreement with each other, thus demonstrating their accuracy.[1123]

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“…A micro-gluing grip [15] was employed by Higo et al of Tokyo Institute of Technology, which uses an instant glue to fix the micro-sized specimen.…”

Section: A Tensile Testing Methodsmentioning

confidence: 99%

Cross comparison of thin-film tensile-testing methods examined using single-crystal silicon, polysilicon, nickel, and titanium films

Tsuchiya

Hirata

Chiba

et al. 2005

J. Microelectromech. Syst.

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“…The stress distribution in the cross section of the deflected membrane and the maximum stress s max can be calculated analytically using (9). The maximum stress s max is found at the bottom of the edge (z = 0) and can be calculated as…”

Section: Analytical Modelmentioning

confidence: 99%

“…Microtensile testing has been widely used to characterize the mechanical and fracture properties of microscale thin films [4]- [6], [9], [10]. The analytical model for the uniaxially stressed tensile specimen is straightforward, whereas the specimen preparation and handling are delicate.…”

mentioning

confidence: 99%

“…The analytical model for the uniaxially stressed tensile specimen is straightforward, whereas the specimen preparation and handling are delicate. Electrostatic force [4]- [6], glue [9], mechanical hook, and tweezers [10] have been used to hold the microscale specimen in order to expose such tiny specimens to mechanical loads. Sharpe et al [4] reported the fracture strengths of 0.38 ± 0.13, 0.47 ± 0.15, and 0.78 ± 0.28 GPa for straight, curved, and notched 3C-SiC specimens, respectively, with thicknesses of about 143 µm.…”

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confidence: 99%

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Fracture Properties of Silicon Carbide Thin Films by Bulge Test of Long Rectangular Membrane

Zhou¹,

Yang²,

Sun

et al. 2008

J. Microelectromech. Syst.

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This paper reports the mechanical properties and fracture behavior of silicon carbide (3C-SiC) thin films grown on silicon substrates. Using bulge testing combined with a refined load-deflection model of long rectangular membranes, which takes into account the bending stiffness and prestress of the membrane material, the Young's modulus, prestress, and fracture strength for the 3C-SiC thin films with thicknesses of 0.40 and 1.42 µm were extracted. The stress distribution in the membranes under a load was calculated analytically. The prestresses for the two films were 322 ± 47 and 201 ± 34 MPa, respectively. The thinner 3C-SiC film with a strong (111) orientation has a plane-gstrain moduli of 415 ± 61 GPa, whereas the thicker film with a mixture of both (111) and (110) orientations exhibited a plane-strain moduli of 329 ± 49 GPa. The corresponding fracture strengths for the two kinds of SiC films were 6.49 ± 0.88 and 3.16 ± 0.38 GPa, respectively. The reference stresses were computed by integrating the local stress of the membrane at the fracture over edge, surface, and volume of the specimens and were fitted with Weibull distribution function. For the 0.40-µm-thick membranes, the surface integration has a better agreement between the data and the model, implying that the surface flaws are the dominant fracture origin. For the 1.42-µm-thick membranes, the surface integration presented only a slightly better fitting quality than the other two, and therefore, it is difficult to rule out unambiguously the effects of the volume and edge flaws.[ 2007-0191]Index Terms-Bulge test, fracture property, microelectromechanical systems (MEMS), silicon carbide (SiC) thin films, Weibull distribution function.

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“…A micro -gluing grip was employed by Higo et al [14] at Tokyo Institute of Technology (Tokyo Tech), which uses an instant glue to fi x the micro -sized specimen. An electrostatic grip was employed by Tsuchiya et al at Toyota Central Research and Development Laboratories (TCRDL) [9] , which uses electrostatic force to chuck the specimen.…”

Section: Tensile Testing Methodsmentioning

confidence: 99%

Evaluation of Mechanical Properties of MEMS Materials and Their Standardization

Tsuchiya

2007

Reliability of MEMS

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The importance of the mechanical properties evaluation on designing and evaluating MEMS and the development of standard on MEMS are described in this chapter. First, in order to confi rm their importance, the effect of mechanical properties on the performance of MEMS is pointed out. Second, to reveal the accuracy and repeatability of the existing evaluation methods, a work for cross comparisons is described. Then, the current workings on the international standard development on thin fi lm mechanical properaties to improve the reliability, repeatability, and accuracy in the mechanical properties evaluation are introduced.

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Fatigue Testing Machine of Micro-Sized Specimens for MEMS Applications

Cited by 29 publications

References 3 publications

Cross comparison of thin-film tensile-testing methods examined using single-crystal silicon, polysilicon, nickel, and titanium films

Cross comparison of thin-film tensile-testing methods examined using single-crystal silicon, polysilicon, nickel, and titanium films

Fracture Properties of Silicon Carbide Thin Films by Bulge Test of Long Rectangular Membrane

Evaluation of Mechanical Properties of MEMS Materials and Their Standardization

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