Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications

Bajpai, Vishnu Kant; Mishra, Dileep Kumar; Dixit, Pradeep

doi:10.1016/j.apsusc.2022.152494

Cited by 19 publications

(18 citation statements)

References 27 publications

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“…Bajpai et al [152] investigated the impact of thermal annealing on the adhesion strength of the electrodeposited copper film on the electroless deposited seed layer of nickel. Glass was first cleaned using a soap solution.…”

Section: Thermal Annealingmentioning

confidence: 99%

“…Bajpai et al [152] demonstrated the metallization of 4-turn spiral 3D microstructures embedded in the glass (Figure 41). The 3D microstructure was metalized with a nickel seed layer using the conventional electroless deposition process.…”

Section: Embedded 3d Ipdmentioning

confidence: 99%

“…A peel-off test was conducted on the glass samples, and the results are shown in Figure 21.

Figure 21 Optical images of the peel adhesion test on the glass surface after (a) electroless deposition, (b) after electroless deposition + electrodeposition, (c) after electroless deposition + electrodeposition + annealing [152]. [Elsevier License Number – 5334601221507]. …”

Section: Various Adhesion Improvement Techniques Of Electroless Coppe...mentioning

confidence: 99%

“…It is evident from Figure 22(g,h) that there is no delamination of the copper film from the glass.

Figure 22 Optical images of the cross-hatch peel adhesion test on the glass surface after annealing [152]. [Elsevier License Number – 5334601221507]. …”

Section: Various Adhesion Improvement Techniques Of Electroless Coppe...mentioning

confidence: 99%

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A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

Pawar

Dixit

2022

Surface Engineering

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This article reviews the state-of-the-art electroless copper deposition on glass substrates and the associated challenges.The well-known issue of poor adhesion of electroless copper with the glass substrate was addressed and later, improved bymodifying the surface energy using a specific chemical treatment or by creating localized surface roughening. Localized surfaceregions in the glass were created by abrasive-based ultrasonic machining and hightemperature electrochemical-discharge machiningtechniques. The effect of critical process parameters on the surface roughness and morphology was explained. Both qualitative andquantitative adhesion measurement techniques, such as cross-hatch tests and 90°/180°p eel adhesion tests, were presented. Theadhesion strength is affected by the surface roughness of the substrate and residual stress build-up in the film. As the build-up stresscan be released by the post-deposition annealing, the adhesion strength is further increased. Finally, the electroless coppertechnology in making through-glass-vias and embedded redistribution lines are presented.

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Section: Thermal Annealingmentioning

confidence: 99%

Section: Embedded 3d Ipdmentioning

confidence: 99%

“…A peel-off test was conducted on the glass samples, and the results are shown in Figure 21.

Section: Various Adhesion Improvement Techniques Of Electroless Coppe...mentioning

confidence: 99%

“…It is evident from Figure 22(g,h) that there is no delamination of the copper film from the glass.

Figure 22 Optical images of the cross-hatch peel adhesion test on the glass surface after annealing [152]. [Elsevier License Number – 5334601221507]. …”

Section: Various Adhesion Improvement Techniques Of Electroless Coppe...mentioning

confidence: 99%

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A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

Pawar

Dixit

2022

Surface Engineering

Self Cite

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“…From such diversified spectrum of applications, it has been evident that MEMS are useful candidates in medical, chemical, and biological fields [9][10][11] . Recent developments in MEMS technology, in particular, have completely changed trends in a variety of industries, including sports, aerospace, biomedicine, electronics, home appliances, and automotive [12][13][14][15][16] . Microscale MEMS devices can run independently or in conjunction with other hardware.…”

Section: Introductionmentioning

confidence: 99%

A Review on Microchannel Fabrication Methods and Applications in Large-Scale and Prospective Industries

Afzal¹,

Tayyaba²,

Ashraf³

et al. 2022

Evergreen

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Microchannels based on microelectromechanical systems (MEMS) have received a lot of interest in the microfluidics and biomedical fields over the past forty years. While their applications have been multifarious, a comprehensive literature review focusing on their design, type, and applications is not currently present in the literature. Researchers working on these elements of microchannels will gain targeted knowledge from the current review on microchannels. Due to its advanced properties, flexibility of mass, and small size, microdevice demand has been rising quickly, particularly in industrial applications. The classification of microchannels and their uses are the main focus of this work. These include but are not limited to molding, electroplating, lithography, lab-ona-chip, micromolding, micromachining, micromilling, laser ablation, lithography, microcontact printing (µcp), hot embossing, electrochemical micromachining (EMM), and etching. In addition, numerous hybrid techniques for microchannel manufacturing have been reported. So, in essence, this review offers a range of advancements in microchannel manufacturing. The review also attempts to present a qualitative analysis describing the various methodologies associated with microchannels in terms of their design, shape, and flow regimes for applications such as pressure drop and transfer of heat prediction. Additionally, depending on the precise uses needed, a number of materials, including but not limited to ceramics, silicon, metals, and polymers, are utilized in the manufacture of microchannels. On metallic substrates, polymers such as silicon, glass, and polymeric materials are used. The biomedical industry uses polymeric and glass substrates instead of silicon substrates, which are used for mechanical engineering and electronic applications. In addition to outlining methods for choosing the best kind of microchannel, this paper also suggests important directions for the future.

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Ultrahigh Aspect Ratio Through Glass Vias Perforation Utilizing Selective Laser‐Induced Etching with Nanochannels

Liu,

Xia,

Ming

et al. 2024

Adv Eng Mater

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At present, perforation of high aspect ratio through glass vias (TGVs) is one of the primary factors limiting the development of glass interposers. This study is based on a large number of experiments, combined with mechanistic analysis, to realize the perforation of ultra‐high/high aspect ratio fused silica TGVs using selective laser‐induced etching (SLE). Firstly, the effect of the number of pulses as well as other laser parameters on the etching selectivity is systematically investigated. It is found that the formation of nanochannels in fused silica is crucial in determining the high selectivity. Subsequently, a model based on diffusion theory is proposed to mathematically explain the reasons for the high selectivity generation. Finally, the perforations of TGVs with diameters of 5.4 µm ‐ 26.4 µm, aspect ratios of 11.7 ‐ 61.3 and vertical sidewalls are achieved, at a laser treatment speed of approximately 10,000 TGVs per minute. This research can serve as an essential reference for the manufacturing of TGVs with high aspect ratios and glass interposers with high interconnection density.This article is protected by copyright. All rights reserved.

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Fabrication of Through-glass Vias (TGV) based 3D microstructures in glass substrate by a lithography-free process for MEMS applications

Cited by 19 publications

References 27 publications

A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

A critical review of copper electroless deposition on glass substrates for microsystems packaging applications

A Review on Microchannel Fabrication Methods and Applications in Large-Scale and Prospective Industries

Ultrahigh Aspect Ratio Through Glass Vias Perforation Utilizing Selective Laser‐Induced Etching with Nanochannels

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