Fabrication of silicon nanotip arrays with high aspect ratio by cesium chloride self-assembly and dry etching

Abstract

Nanotip arrays with high aspect ratio, which have attracted much attention due to their potential applications, have been fabricated by many methods. Dry etching combined with self-assembly masks is widely used because of the convenience of dry etching and high throughput of self-assembly. In this paper, we report a method combining Cesium Chloride (CsCl) self-assembly with inductively coupled plasma (ICP) dry etching to fabricate silicon nanotip arrays with high aspect ratio and silicon nanotip arrays with aspect ratio 15 have been achieved after optimization of all parameters.

Preface: Micro-Nano Technology

“…4 On the fabrication side, polyimide sacrificial layers with inclined sidewalls based on reactive ion etching, 5 silicon nanotip arrays with high aspect ratio based on cesium chloride self-assembly and dry etching, 6 anti-adhesion surfaces on aluminium substrates of rubber plastic moulds using a coupling method of liquid plasma 7 and electrochemical machining and super-hydrophobic surfaces on aluminum alloy substrates by RFsputtered polytetrafluoroethylene coatings are presented. 8 Laser-heating wire bonding on MEMS packaging, 9 Spray-coating process in preparing PTFE-PPS composite super-hydrophobic coating 10 and pulse electrodeposition of Fe-Ni alloy are researched; 11 Besides, synthesis of silver particles on copper substrates using ethanol-based solution for surface-enhanced Raman spectroscopy is introduced.…”