Fabrication of oriented hBN scaffolds for thermal interface materials

Shen, Hui‐Hui; Cai, Chao; Guo, Jing; Qian, Zhenchao; Zhao, Ning; Xu, Jie

doi:10.1039/c6ra00980h

Cited by 113 publications

(70 citation statements)

References 41 publications

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“…This is a relatively straightforward method but the compression moulding process itself is not commercially significant and therefore of limited interest. Another approach is to construct a freestanding filler framework as the heat transfer network, such as a graphene aerogel [39][40][41], BNNS aerogel [42,43] or complex aerogel [9,[44][45][46], and then encasing the network in a thermosetting matrix such as epoxy. Jiang et al [9] prepared a cellulose nanofiber supported boron nitride aerogel via sol-gel and freeze-drying, followed by casting with epoxy.…”

Section: Introductionmentioning

confidence: 99%

Constructing a filler network for thermal conductivity enhancement in epoxy composites via reaction-induced phase separation

Zhang

Shen

Shi

et al. 2018

Composites Part A: Applied Science and Manufacturing

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Diglycidyl ethers of bisphenol-A (DGEBA)/methyl tetrahydrophthalic anhydride/polyethersulphone (PES) blends are prepared as matrix resins for thermally conductive composites using graphite nanoplatelets (GNPs) as the conductive component. The epoxy/PES blends form a network structure via reaction-induced phase separation (RIPS) during the curing process, and the GNPs are selectively localized in the PES phase and at the interface leading to a three-dimensional continuous filler network. With this unique structure, the thermal conductivity of the epoxy/PES/10 wt% GNPs composite is increased to 0.709 W m-1 K-1 , which is nearly 3.5 times that of the pure epoxy or a 52% increase compared to the epoxy/GNP composite without PES. In addition, it is found that the impact strength of the composite relative to the unfilled material is also improved.

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Section: Introductionmentioning

confidence: 99%

Constructing a filler network for thermal conductivity enhancement in epoxy composites via reaction-induced phase separation

Zhang

Shen

Shi

et al. 2018

Composites Part A: Applied Science and Manufacturing

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“…However, it is noticed there is a smaller reduction of T g in EPB3 and even increase in EPB5. This Journal XX (XXXX) XXXXXX Dayuan et al should be due to a mix of the exfoliated and intercalated macroscopic layer structures of hBN-based nanocomposites [32][33][34] as shown in Fig. 22 which would impair the mobility of chain segments in the vicinity of particles, and thus increase the glass transition temperature [25,35].…”

Section: Dsc Experimentsmentioning

confidence: 99%

Thermal stability of epoxy nanocomposites: surface treatment and morphology impact based on nano SiO₂ and hBN fillers

Qiang

Wang

et al. 2019

Mater. Res. Express

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Epoxy resin is one of the most commonly used thermosetting macromolecular synthetic materials. It displays excellent adhesiveness properties, good dielectric property, mechanical property and chemical stability. Consequently, epoxy resins have been widely used for many industrial purposes, such as electrical casting into power transformers, ignition coil systems and potting. In this paper, TGA and DSC measurements were carried out to evaluate the thermal stability of epoxy nanocomposites. Based on the results of dispersion and distribution of particles within epoxy nanocomposites, it concluded that both presences of nano SiO 2 and hexagonal BN (hBN) particles have obvious impact on base materials in which the influences of latter particle are much more significant due to its shape, and thus both fillers leads to worse thermal stability than pure samples. However, particles could act as flame retardants in polymer nanocomposites and postpone the initiation of decomposition by hindering/slowing the oxidisation. When compared within two SiO 2 based nanocomposites, the surface treatment seems to help mitigate the influences on base materials by achieving better filler dispersion and modify the cross-linking density at the interfacial areas by removing surface functional groups.

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“…However, some surface functionalization methods are challenging to perform and the effect of these methods in improving the thermal conductivity of composite materials is still limited [ 25 , 26 , 27 ]. Of late, many studies have reported various preparation methods for establishing a three-dimensional heat conduction network in the composites to deal with the issue mentioned above [ 27 , 28 , 29 , 30 ]. Through the compact network structure of continuous thermally conductive fillers, the effect of phonon scattering can be reduced which in turn reduces the interfacial thermal resistance thereby achieving higher thermal conductivity.…”

Section: Introductionmentioning

confidence: 99%

Generation of Self-Assembled 3D Network in TPU by Insertion of Al2O3/h-BN Hybrid for Thermal Conductivity Enhancement

Chi

et al. 2021

Materials

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Thermal management has become one of the crucial factors in designing electronic equipment and therefore creating composites with high thermal conductivity is necessary. In this work, a new insight on hybrid filler strategy is proposed to enhance the thermal conductivity in Thermoplastic polyurethanes (TPU). Firstly, spherical aluminium oxide/hexagonal boron nitride (ABN) functional hybrid fillers are synthesized by the spray drying process. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Then, ABN/TPU thermally conductive composite material is produced by melt mixing and hot pressing. Our results demonstrate that the incorporation of spherical hybrid ABN filler assists in the formation of a three-dimensional continuous heat conduction structure that enhances the thermal conductivity of the neat thermoplastic TPU matrix. Hence, we present a valuable method for preparing the thermal interface materials (TIMs) with high thermal conductivity, and this method can also be applied to large-scale manufacturing.

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Fabrication of oriented hBN scaffolds for thermal interface materials

Abstract: Three dimensional scaffolds of hBN microplatelets prepared by ice templating method are used to fabricate hBN/PDMS composites with vertically aligned hBN for thermal interface materials.

Cited by 113 publications

References 41 publications

Constructing a filler network for thermal conductivity enhancement in epoxy composites via reaction-induced phase separation

Constructing a filler network for thermal conductivity enhancement in epoxy composites via reaction-induced phase separation

Thermal stability of epoxy nanocomposites: surface treatment and morphology impact based on nano SiO₂ and hBN fillers

Generation of Self-Assembled 3D Network in TPU by Insertion of Al2O3/h-BN Hybrid for Thermal Conductivity Enhancement

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Fabrication of oriented hBN scaffolds for thermal interface materials

Abstract: Three dimensional scaffolds of hBN microplatelets prepared by ice templating method are used to fabricate hBN/PDMS composites with vertically aligned hBN for thermal interface materials.

Cited by 113 publications

References 41 publications

Constructing a filler network for thermal conductivity enhancement in epoxy composites via reaction-induced phase separation

Constructing a filler network for thermal conductivity enhancement in epoxy composites via reaction-induced phase separation

Thermal stability of epoxy nanocomposites: surface treatment and morphology impact based on nano SiO2 and hBN fillers

Generation of Self-Assembled 3D Network in TPU by Insertion of Al2O3/h-BN Hybrid for Thermal Conductivity Enhancement

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Product

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Thermal stability of epoxy nanocomposites: surface treatment and morphology impact based on nano SiO₂ and hBN fillers